Indium Corporation to Highlight High-Reliability Solder Solutions for EV and Mobile at Productronica India

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As a leading materials provider to the electric vehicle (EV) and e-mobility industries—addressing power module- and PCBA-level applications—Indium Corporation® will showcase its advanced Rel-ion® products at Productronica India, April 8-10, in Greater Noida, India.

The company will feature the following products:

- Durafuse® Technology is a patented solder paste alloy system that delivers breakthrough performance in solder joint quality and reliability in complex designs. Trusted across mobile and automotive applications, it achieves exceptional reliability at lower processing temperatures—reducing your carbon footprint while replacing Pb-containing materials in high-temperature die-attach applications.

• Durafuse® LT is a low-temperature alloy ideal for large BGA assemblies prone to temperature-induced warpage, uneven PCB heating during reflow, or assemblies with temperature-sensitive components. It reduces peak reflow temperature while exhibiting superior thermal cycling and drop shock performance.
• Durafuse® HR delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding control for high-reliability automotive applications.

- Indium12.9HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN, and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.

- InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.