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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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P Kay Metal's MS2 Dross Eliminator Delivers Measurable Results for Electronics Manufacturers Across Latin America

08/20/2026 | P. Kay Metal, Inc.
P Kay Metal is seeing growing adoption of its MS2 Dross Eliminator throughout the region, with customers consistently reporting solder recovery rates of 80–85%.

The Relevance of VeCS as an HDI Process Option

08/20/2026 | Marcy LaRont, I-Connect007
Almost 10 years ago, Pete Starkey interviewed Joan Tourné, inventor and CEO of his new company, NextGin Technology. Joan’s resume included many years as a director at Mommers Print Service in the Netherlands, and then as advanced technology and business director with Viasystems Group. He had just secured his IP for a vertical conductive structure (VeCS), a novel means of creating high density vertical interconnections for semiconductors and complex, high layer count PCBs. This month, we re-examine VeCS technology, a method for HDI PCB fabrication with large backplane-type boards developed in partnership with Wus, which uses the technology in its factories.

A University Model for Training the Next Generation of PCB Designers

08/19/2026 | Marcy LaRont, I-Connect007
Veteran PCB designer and educator John Watson has building one of the nation's most comprehensive university-based PCB design certificate programs in the country. He’s working with Palomar College, UC San Diego, UC Santa Cruz, and UMass Lowell to teach the complete design-to-manufacturing process while connecting students with internships and career opportunities. I spoke with John about the industry's workforce challenges, building meaningful educational pathways, and why the next generation of PCB designers may come from places few would expect.

PCB West Panel to Take On What’s Next for PCB Design

08/19/2026 | PCEA
The Printed Circuit Engineering Association (PCEA) has announced a panel discussion on the technologies reshaping printed circuit board design over the next two to five years will take place at PCB West 2026.

Dan’s Biz Bookshelf: Revisiting 'The Popcorn Report'

08/20/2026 | Dan Beaulieu -- Column: Dan's Biz Bookshelf
One of the things I enjoy most about reading is occasionally rereading books that made a big impression years ago. Sometimes they hold up beautifully, sometimes they don't, and sometimes they become even more interesting because time has given us a completely different perspective. That's exactly what happened when I recently picked up "The Popcorn Report" by Faith Popcorn, first published in 1991.
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