Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Learning with Leo: The Cost of Cleaning and Protecting the Ozone Layer

06/02/2026 | Leo Lambert -- Column: Learning With Leo
I share this perspective based on my experience as a member of the United Nations Environment Programme (UNEP) Solvent, Coatings and Adhesives Technical Options Committee, which developed the report “Protecting the Ozone Layer” to inform policy decisions at the 1995 Meeting of the Parties to the Montreal Protocol in Nairobi. My involvement in this work dates back to 1976, when I joined Digital Equipment as an engineer supporting manufacturing operations, focusing on soldering and cleaning processes across global facilities.

Happy’s Tech Talk #48: Digital Twins—Integrating Design and Manufacturing

06/02/2026 | Happy Holden -- Column: Happy’s Tech Talk
New product realization and design for manufacturing and assembly (DFM/A) are becoming increasingly visible as programs that can improve time-to-market and reduce product costs. These simulations of real-time manufacturing are now referred to as digital twins. While many companies are developing such programs, a unifying framework is needed to coordinate their application.

BAE Systems Delivers Next-Generation Flight Hardware for U.S. Space Force Missile Warning Program

05/18/2026 | BAE Systems
BAE Systems has delivered the sensor subassembly and sensor system controller components for the Next Generation Overhead Persistent Infrared Polar (NGP) program.

RBB Earns AS9100 Certification, Expands Aerospace and Defense Credentials

05/15/2026 | RBB
RBB, a trusted leader in electronics manufacturing since 1973, has achieved AS9100 certification, meeting the stringent quality, traceability, and risk management standards required in aerospace and defense industries.

yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data

05/11/2026 | PRNewswire
Board-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in