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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Scanfil Delivers a Strong Q2 as Strategic Progress Reshapes the Company

07/17/2026 | Scanfil
Scanfil reports second-quarter turnover rose 28.1% to EUR 259.0 million, with comparable EBITA up 30.8% to EUR 18.6 million and a margin of 7.2%.

The AI Data Center Boom: Technology, Capacity, and Society

07/17/2026 | Marcy LaRont, I-Connect007
AI begins with advanced chips, but delivering AI at scale depends on an ecosystem of technologies that extends far beyond the semiconductor. In this interview, Andrew Bradner, senior vice president of Schneider Electric's cooling business, explains how AI is transforming data center design, why liquid cooling has become essential, and what these shifts mean for advanced packaging, power delivery, thermal management, and the broader electronics supply chain supporting next-generation AI infrastructure.

3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.

July I-Connect007 Magazine: Business Diversification and Display Electronics

07/15/2026 | I-Connect007 Editorial Team
This month's I-Connect007 Magazine explores two critical challenges facing today's electronics industry: how PCB fabricators can build more resilient businesses through strategic diversification, and how PCB designers can successfully tackle the unique demands of modern display electronics.

American Standard Circuits to Exhibit at the 2026 Farnborough International Airshow

07/14/2026 | American Standard Circuits
American Standard Circuits (ASC), one of North America's leading manufacturers of advanced printed circuit boards for aerospace, defense, medical, industrial, and high-reliability applications, will be exhibiting at the Farnborough International Airshow taking place July 20–24, 2026 in Farnborough, United Kingdom.
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