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Advanced Electronics Packaging Digest

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Suggested Items

ASMPT SMT Solutions at EFX Expo for Electronics Manufacturing

08/07/2026 | ASMPT
ASMPT SMT Solutions will exhibit at the first EFX Expo for Electronics Manufacturing in Stuttgart, Germany.

Gilat Demonstrates AI-Based Interference Detection Technology for Satellite Links

08/07/2026 | Globe Newswire
Gilat Satellite Networks Ltd., a worldwide leader in satellite networking technology, solutions, and services, announced the successful demonstration of a breakthrough AI-based interference detection and cancellation technology for satellite communication links.

Extropic Signs $75M LOI with U.S. Commerce Department

08/03/2026 | PRNewswire
Extropic, the American company pioneering thermodynamic computing hardware, announced the signing of a letter of intent with the U.S. Department of Commerce for up to $75 million in funding through the CHIPS Research and Development Office (CRDO).

Alpha Circuit Chooses atg Flying Probe Technology for High-speed Electrical Test and Automation

08/03/2026 |
Atg Mycronic GmbH and IEC USA confirm an order for an atg A7a, 8 head, double-sided, high speed, auto-load/unload system, for true “lights-out” operation from Alpha Circuit in Schaumburg, IL.

Learning With Leo: Where Reliability Actually Hides

08/05/2026 | Leo Lambert -- Column: Learning With Leo
In my many years of training, it’s funny to see what still surprises people. For example, they’re surprised that by the time the solder melts, most of what decides whether that joint survives has already happened before the iron and even before inspection. In fact, it’s even earlier than that. In my column last month, I argued that most soldering problems are really problems of interpretation, which leads to the materials themselves, and where reliability is won or lost. So, let’s talk about what we’re actually soldering today.
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