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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Scanfil Celebrates 50-Year Journey from Small Workshop to Global Contract Manufacturing Group

06/04/2026 | Scanfil
Scanfil was registered with the Finnish Trade Register on 4 June 1976 when Jorma J. Takanen started operations in his brother's garage in Sievi, Finland.

Road to Reliability: The Foundational Technologies of Materials in EV Reliability

06/04/2026 | Stanton Rak, SF Rak Company
EV reliability is often discussed at the vehicle or system level, but many of the most persistent failures begin at the materials level. Semiconductor devices, ceramic substrates, die attach materials, wire bonds, clips, thermal interface materials, laminates, coatings, seals, and coolants define the electrical, thermal, and mechanical limits of the hardware. Once EV architectures move toward higher voltages, switching speeds, and power density, and longer service life, those materials are pushed harder, and small weaknesses can turn into large field problems

American Standard Circuits to Exhibit at IMS 2026 in Boston

06/02/2026 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits, has announced that the company will be exhibiting at IMS 2026, the world’s leading event for RF, microwave, and high-frequency technologies, taking place June 8th through June 13th, 2026, at the Thomas M. Menina Convention and Exhibition Center in Boston, Massachusetts.

Beyond Design: How Signals Survive the Hostile PCB Environment

06/03/2026 | Barry Olney -- Column: Beyond Design
Modern digital signals exhibit behavior more characteristic of RF waveforms than the slow logic transitions of the past. With fast rise times, a PCB is no longer a collection of copper traces, but a distributed electromagnetic system. Successful design isn’t about routing signals anymore; it’s about engineering transmission lines, preserving uninterrupted return‑current paths, and controlling the resonant structures that naturally form within the multilayer PCB.

Happy’s Tech Talk #48: Digital Twins—Integrating Design and Manufacturing

06/02/2026 | Happy Holden -- Column: Happy’s Tech Talk
New product realization and design for manufacturing and assembly (DFM/A) are becoming increasingly visible as programs that can improve time-to-market and reduce product costs. These simulations of real-time manufacturing are now referred to as digital twins. While many companies are developing such programs, a unifying framework is needed to coordinate their application.
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