Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense
Defense Speak Interpreted: Hypersonics Report Back After Six Years of Silence
American Made Advocacy: American Microelectronics Power the Future of High Technology
Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions
April 10, 2026 | Real Time with... APEX EXPOEstimated reading time: Less than a minute
Jason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.
APEX EXPO 2026 has concluded successfully. If you couldn’t make it to the show, don’t worry, the I-Connect007 team has coverage of the entire week’s events. Watch your inbox on Fridays over the next several weeks for our complete coverage, delivered directly to your inbox, or visit Real Time with… APEX EXPO 2026 now for video interviews with the movers and shakers of the electronics industry.
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Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.
John Andresakis Discusses Integrated Thin-film Resistive Foil Technology
04/10/2026 | Real Time with... APEX EXPOJohn Andresakis of Ohmega Ticer shares his advanced solution that offers miniaturization, enhanced electrical performance, and stable resistance for next-generation PCBs. The high-demand applications for high-frequency phased-array antennas in commercial space and military sectors is driving the need for superior RF performance and simplified beam forming.
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
04/08/2026 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsWhen I last wrote about data, I focused on data quality and size, data infrastructure, the boundaries of data training, data preparation, and the general challenges and concerns of data. This month, I will focus on alternative approaches, data governance, retrieval-augmented generation (RAG), and agentic RAG.
Ventec Showcases Glass Free Revolution and Launches Chiplam Portfolio at APEX EXPO 2026.
03/11/2026 | Ventec International GroupVentec International Group invites attendees of APEX EXPO 2026 to Booth 4642 to experience its Glass Free Revolution and the official launch of chiplam, a new high-performance materials portfolio for advanced semiconductor packaging and test applications.
Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough
03/17/2026 | Chandra Gupta -- Column: Below the SurfaceIn my last column, I described the ceramic substrate itself, and why material choice matters so deeply in RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, stability across temperature, and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise.