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Siemens, NVIDIA Expand Agentic AI Collaboration for 3D IC Power and Thermal Design

10/21/2026 | Siemens
Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with NVIDIA.

What It Takes to Test Automotive Power Electronics Assemblies

10/21/2026 | Francesca Pinto, SPEA
Power electronics board assemblies are central to modern vehicle power systems. They include voltage regulators, motor drivers, inverters, DC-DC converters, and onboard chargers, which are found across the range of today's vehicles, from conventional combustion engines to hybrids and full electric vehicles. However, modern power PCBAs do far more than just route and manage electrical energy flow through the vehicle, converting and regulating power for everything from the starter and alternator to the traction motor.

Hitachi Energy, Ansaldo Energia Partner on Integrated Power Solutions

10/19/2026 | Hitachi Energy
Hitachi Energy and Ansaldo Energia signed a Memorandum of Understanding to develop and market integrated power solutions designed to help customers secure reliable power faster and meet rapidly growing electricity needs with greater flexibility, resilience and speed.

onsemi, Sungrow Advance Energy Storage with SiC Technology

10/19/2026 | onsemi
onsemi announced that Sungrow, a global leader in renewable energy technology, has adopted onsemi’s latest EliteSiC silicon carbide (SiC) hybrid power module technology for the Sungrow PowerTitan 3.0 energy storage platform.

Enabling the Interconnect Technologies That Transform Our World: MKS’ Strategic Role in Powering the Future of AI and HPC

10/20/2026 | John T.C. Lee, with Won Lee, Marc Tricard, and Kuldip Johal
AI is reshaping industries, economies, and daily life at an unprecedented speed. From generative AI and autonomous systems to high-performance computing (HPC) applications in science, defense, and advanced manufacturing, the demand for computational power is accelerating exponentially. But while algorithms capture the spotlight, the true enabler of this transformation lies deeper, in the physical infrastructure that makes AI possible. Performance in the AI era is no longer defined by transistor shrink alone. It is increasingly defined by how efficient systems are integrated, interconnected, cooled, and manufactured at scale.
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