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Cyberattack via Ransomware at Major EMS Provider Foxconn

05/15/2026 | I-Connect007 Editorial Team
A recent cyberattack targeting Foxconn has once again exposed the growing vulnerability of global manufacturing and electronics supply chains to ransomware operations. According to CyberScoop, the attack disrupted operations at several of Foxconn’s North American facilities, temporarily forcing some production activities into manual workarounds while systems were restored.

SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding

05/14/2026 | BUSINESS WIRE
SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.

Rethinking Reinforcement Materials for Advanced Packaging

05/14/2026 | Ivana Ivanovic, Flexiramics B.V.
Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.

Scanfil Signs Agreement with Leading Industrial Automation Company

05/13/2026 | Scanfil
Scanfil has signed an agreement with a leading industrial automation company, part of a global technology group, strengthening its position in demanding industrial automation and electronics manufacturing applications.

Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components

05/13/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 
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