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Nokia Announces Major Expansion of U.S. Semiconductor Advanced Test and Packaging in Pennsylvania to Bolster AI Growth

06/24/2026 | Nokia
Nokia announced a major expansion of its advanced test and packaging (ATP) operations in Allentown, Pennsylvania. The investment will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity across the United States.

Gov. Hochul, TTM Technologies Mark Opening of $130M Manufacturing Facility in Dewitt

06/24/2026 | New York State Government
Governor Kathy Hochul announced the completion of TTM Technologies, Inc.’s new manufacturing facility located in Central New York. A leading global manufacturer of technology solutions, the company’s new state-of-the-art manufacturing facility is co-located on approximately 23 acres adjacent to TTM’s existing production facility in the Town of DeWitt, Onondaga County.

Japan Accelerates ASSB Development, Supply Chain with $660M Government Subsidies

06/24/2026 | TrendForce
TrendForce's latest “2Q26 Global Solid-State Battery Industry Development Quarterly Report” reveals that the Japanese government has significantly expanded support for next-generation battery technologies in recent years.

TTM Technologies Opens Ultra-HDI Manufacturing Facility in Syracuse, NY

06/23/2026 | TTM Technologies
TTM Technologies, Inc., a leading U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, today celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board (PCB) manufacturing facility in Syracuse, New York — marking a significant investment in domestic defense electronics manufacturing.

Imec Achieves Breakthroughs in Ferroelectric Memory for AI-Era Needs

06/22/2026 | Imec
At the 2026 IEEE / JSAP symposium on VLSI Technology & Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents two advances in ferroelectric memory research, targeting both ferroelectric capacitors and ferroelectric field-effect transistors as emerging candidates to enable low-voltage operation and high-density integration.
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