-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
TPCA and Industry Leaders Convene in Bangkok for Thailand PCB Summit
April 30, 2026 | TPCAEstimated reading time: 5 minutes
At a critical juncture of global supply chain restructuring and the explosive growth in demand for AI computing power, Thailand is becoming a crucial hub for the next wave of high-end manufacturing in the electronics and circuit industry. The Taiwan Printed Circuit Association (TPCA) and the Thai Printed Circuit Association (THPCA) co-hosted the "2026 Thailand PCB Industry Summit" in Bangkok on April 27, releasing the industry survey report "Opportunities for the Thai PCB Industry Under the Intersection of the AI Wave and Geopolitics," and focusing on key implementation issues such as work permit applications, talent cultivation, infrastructure, and industrial policies.
This summit, positioned as a "strategic dialogue platform at the highest levels," was supported by the Hong Kong Printed Circuit Association (HKPCA) and the China Circuit Industry Association (CPCA), bringing together nearly 60 industry leaders and representatives from Taiwan, China, and Thailand for exchange. Representatives from official organizations including BOI, IEAT, NXPO, and the Thai Ministry of Labor also attended, demonstrating the Thai government's high regard for the development of the PCB industry and international cooperation. A key highlight of the summit was the cross-regional survey report, "Opportunities for the Thai PCB Industry at the Intersection of AI and Geopolitics," jointly completed by TPCA, THPCA, and HKPCA. Through cross-regional questionnaires and industry opinion summaries, the report reveals the shared concerns of the PCB industries in China, Hong Kong, Taiwan, and Thailand regarding investment strategies, supply chain localization, and talent development in Thailand. This not only enhances the report's representativeness but also highlights the trend of closer regional cooperation within the Asian PCB industry amidst global industrial restructuring.
AI propels the global PCB market to a multi-billion dollar level, creating opportunities for high-value development in Thailand.
According to the report, the global PCB market continues to grow, driven by investment in AI infrastructure, and is projected to reach $92.4 billion in 2025. Looking ahead to 2026, it is expected to further climb to $113.7 billion, representing an annual growth rate of 23.1%. The report points out that the demand for AI computing power is becoming a major driving force for the growth of the global PCB industry, accelerating high-end manufacturing and supply chain restructuring, bringing a new wave of growth opportunities to Thailand's industry and economy.
Facing talent bottlenecks, TPCA continued its "Taiwan-Thailand HR Industry Networking and Industry-Academia Exchange Meeting" that afternoon, further exchanging views on industry-academia cooperation, talent training, and local supply mechanisms. This exchange also focused on how to address the current talent shortage in key functions such as engineering/process, equipment maintenance, and R&D, strengthening the long-term development foundation of Thailand's PCB industry.
Looking at the development trajectory of Thailand's PCB industry, more than 60 PCB manufacturers have established a presence in recent years, and the region is gradually moving towards becoming a high-value manufacturing hub, continuously undertaking application demands such as AI servers, high-end communications, and automotive electronics. Among these applications, automotive electronics accounted for 31%, ranking first among all application areas, demonstrating the continued strength of Thailand's existing automotive industry cluster. On the other hand, with the gradual implementation of investments from over 100 PCB supply chain companies in recent years, the demand for AI servers and communications has increased, driving the development of Thailand's PCB product structure towards higher value-added directions such as high-end multilayer boards (47%) and high-density interconnect boards (HDI, 23%). The report, highlighting PCBs as the cornerstone of the semiconductor industry, calls for increased government support for localized PCB operations. It points out that while Thailand's PCB industry is expanding rapidly, its overall ecosystem still needs improvement. Currently, 46% of companies have a local sourcing ratio of less than 20%, indicating that local supply chain integration needs strengthening. During the industry-government dialogue at the summit, industry representatives focused on four key issues. First, regarding mechanism optimization, they suggested extending the validity period of urgent work permits to 60-90 days and allowing applications to be made in Taiwan before arrival in Thailand to facilitate smooth production of key processes. Second, addressing the talent shortage, they urged the government to support industry-academia collaboration programs and internship systems, and subsidize corporate training programs. Third, in terms of infrastructure, with the increasing demand for high-end manufacturing, stable power, green energy, and water resource processing capabilities are crucial for ensuring stable operations. Finally, the industry has pointed out that under Thailand's policy direction for developing the semiconductor industry, ensuring the sound development of the PCB supply chain is essential to laying a solid foundation for Thailand's technological development. Therefore, there is a strong call for the Thai government to include PCBs in the national key development industries and strengthen policy support for the PCB industry to further enhance Thailand's competitiveness in the global AI supply chain.
Talent bottlenecks are key to industry development. The TPCA's report on promoting professional talent cultivation in Thailand further shows that the most significant shortage currently lies in local material supply (35%), followed by operators and engineering technicians (22%), and equipment parts logistics and maintenance services (21%). From the multiple challenges of material and equipment supply to talent supply, it is clear that if Thailand's PCB industry is to support its next stage of development, it must simultaneously strengthen its supply chain support and talent cultivation foundation. It is estimated that by 2030, the demand for related talent will further increase to 74,200.
As the industry layout gradually takes shape, the focus of Thailand's PCB industry in the next stage is no longer just on expanding production capacity, but on accelerating the construction of a high-end manufacturing ecosystem. Future competitiveness will depend on the localization of the supply chain, the continuous improvement of talent development and related support. TPCA will also continue to collaborate with THPCA, BOI, IEAT, NXPO, TECO, and others to plan more diverse professional talent development platforms, helping to channel government resources into enterprises, jointly supporting the PCB industry chain, enhancing the professional capabilities of Thai talent, and ultimately making a significant contribution to the overall Thai socio-economic development.
The Taiwan Printed Circuit Association (TPCA) and the Thai Printed Circuit Association (THPCA), together with the Hong Kong Printed Circuit Association (HKPCA) and the China Circuit Industry Association (CPCA), co-hosted the "2026 Thailand PCB Industry Summit" in Bangkok on April 27, bringing together nearly 60 industry leaders and representatives from Taiwan, China, and Thailand to exchange ideas.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
KLA Reports Fiscal 2026 Q3 Results
04/30/2026 | PRNewswireKLA Corporation announced financial and operating results for its third quarter of fiscal year 2026, which ended on March 31, 2026, and reported GAAP net income of $1.20 billion and GAAP net income per diluted share of $9.12 on revenues of $3.415 billion.
Element Solutions Reports Record Quarterly Results and Increases 2026 Full Year Guidance
04/30/2026 | BUSINESS WIREElement Solutions Inc, a global and diversified specialty chemicals technology company, announced its financial results for the three months ended March 31, 2026.
Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
04/30/2026 | I-Connect007I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.