Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

EnerSys to Acquire Ultralife

10/28/2026 | BUSINESS WIRE
EnerSys, a global leader in stored energy solutions for industrial, infrastructure, and defense applications, announced that it has entered into a definitive agreement to acquire Ultralife for $16.00 per share in cash, representing a 166% premium to Ultralife’s unaffected closing share price on October 26, 2026.

Lockheed Martin Advances ER GMLRS Toward Operational Fielding and Expanded Production

10/23/2026 | Lockheed Martin
Lockheed Martin is advancing the Extended-Range GMLRS rocket into production and fielding following two successful Soldier-led operational tests.

MKS to Sell Ophir Optics Business to TTM Technologies

10/19/2026 | MKS Inc.
MKS Inc., a global provider of enabling technologies that transform our world, announced that it has entered into a definitive agreement to sell its Ophir® Optics business to TTM Technologies, Inc. in an all-cash transaction for $650 million, subject to customary closing adjustments.

Enabling the Interconnect Technologies That Transform Our World: MKS’ Strategic Role in Powering the Future of AI and HPC

10/20/2026 | John T.C. Lee, with Won Lee, Marc Tricard, and Kuldip Johal
AI is reshaping industries, economies, and daily life at an unprecedented speed. From generative AI and autonomous systems to high-performance computing (HPC) applications in science, defense, and advanced manufacturing, the demand for computational power is accelerating exponentially. But while algorithms capture the spotlight, the true enabler of this transformation lies deeper, in the physical infrastructure that makes AI possible. Performance in the AI era is no longer defined by transistor shrink alone. It is increasingly defined by how efficient systems are integrated, interconnected, cooled, and manufactured at scale.

Qualcomm, Transsion Sign Long-Term Patent Cross-License Agreement

10/19/2026 | Qualcomm Incorporated
Qualcomm Incorporated announced that it has entered into a long-term renewal of its global patent licenses with Transsion Holdings, covering 4G and 5G mobile devices through the end of 2031.  
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in