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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
May 11, 2026 | PRNewswireEstimated reading time: 1 minute
Board-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments. yieldWerx and WATS announce a partnership to bridge this gap in the PCB test and semiconductor manufacturing workflows.
WATS is a test data management platform purpose-built for electronics manufacturers. It captures, standardizes, and analyzes high-volume test data from PCBA (printed circuit board assembly) production environments, including in-circuit test (ICT), functional test, and final test, giving engineers real-time visibility into board-level yield, anomalies, and quality metrics across the production line.
yieldWerx operates at the semiconductor level, connecting data across wafer fabrication, wafer sort, die, and packaged device test. Its enterprise analytics platform enables advanced yield analysis, traceability, and root cause investigation from design through silicon manufacturing.
Together, the platforms address the full product stack. This allows manufacturers to correlate PCBA-level signals with silicon quality data, improving visibility across test stages and enabling more effective analysis of yield and reliability issues.
Customer and industry benefits include:
- Real-time PCBA test visibility for faster identification of yield and quality issues
- Improved correlation between board-level test results and upstream chip or wafer data
- Reduced time spent reconciling data across disconnected systems
- Earlier detection of cross-stage patterns impacting yield and reliability
- Faster root cause analysis spanning silicon, assembly, and board-level test
- Better alignment between electronics manufacturing and semiconductor supply chain
- The combined solution supports open architectures, APIs, and flexible deployment models, enabling integration without large-scale system changes.
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