Defense Speak Interpreted: Understanding What the Department of Defense Is, and Isn’t
American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
For decades, electroless copper has been the industry standard for making PCB holes conductive. But as reliability expectations increase and sustainability pressures grow, manufacturers are exploring new approaches to advanced PCB fabrication. This new book dives into the innovations, reliability challenges, and breakthroughs in direct copper-to-copper bonding that are redefining the future of PCB manufacturing.
Inside the book, readers will explore:
- Direct metallization vs. electroless copper
- Reliability and microvia challenges
- Pulse reverse plating technologies
- Sustainability advantages in PCB fabrication
- The growing demands of AI, HDI, and advanced packaging
Venkat Raja, president and founder of Advint, Inc., said: “This book is an essential resource for fabricators and OEMs seeking to future-proof their high-density interconnect designs while meeting sustainability targets."
The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication is available now as a free download from I-Connect007.
Get it here today!
