TopLine Corporation will exhibit its innovative electronic component solutions and solder column technology in booth #539 at the upcoming Space Tech Expo USA show at the Anaheim Convention Center, Anaheim, California, June 3 – 4, 2026. Space Tech Expo USA is America’s engineering and manufacturing meeting place for space technology. 2026 is the show’s first instance being located in Anaheim.
Aerospace and Defense applications in demanding environments have a solution in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments. On June 3 - 4, Martin Hart, President of TopLine Corporation and holder of multiple patents in the field of electronic components, will exhibit these remarkable breakthrough component solutions at Space Tech Expo.
“Braided Solder Columns are non-collapsible, robust and compliant electrically conductive connectors used for reducing stress caused by CTE mismatch between the component device and the PC board,” Hart says. “Columns are more reliable than solder balls, especially when connecting large-size chip packages to PC Boards operating in cryogenic environments. Additionally, they are available with lead for Aerospace & Defense applications, but also available in lead-free designs for RoHS AI Datacenters, for example.”
“TopLine Solder Column Semiconductor Chip interconnects are designed to withstand cryogenic temperatures such as those encountered in the shadowed regions of the lunar surface. These temperatures are some of the coldest measured anywhere in the solar system. Areas shielded from direct sunlight experience extreme cold. In deep craters near the Moon’s poles, for example, permanent shadows keep the temperature lower than -410°F (-246°C). These forever-dark places harbor ice deposits that may be billions of years old.”
“TopLine’s offering includes superconducting Indium Solder columns for cryogenic operating temperatures and Quantum Computers,” Hart adds. “We repair CCGA/FPGA/ASIC components.” TopLine also provides PID Vibration Dampers for launch, gold bonding wire, and ribbon.”
