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Micron has announced that its Fab 6 facility in Virginia, USA, has begun production of LPDDR4 and DDR4 DRAM using the 1α nm process. The LPDDR4 and DDR4 products manufactured at this fab will be shipped to clients in key application segments such as automotive electronics, industrial equipment, networking, medical devices, and defense and aerospace hardware. According to TrendForce’s latest memory industry research, the expansion at Fab 6 mainly reflects Micron’s internal production capacity reallocation and does not indicate a renewed focus on supplying DDR4 components for consumer electronics.
TrendForce finds that Micron’s production shift aligns with U.S. government policies that encourage the reshoring of manufacturing capacity. The company is repositioning Fab 6 to focus on producing LPDDR4 and DDR4 DRAM, with particular emphasis on the former. The total monthly wafer input at Fab 6 is projected to reach 1.5 times the level of 2Q26 by 4Q27. Mass production using the 1α nm process is expected to commence near the end of 2026. Micron has stated that the combined LPDDR4 and DDR4 supply from Fab 6 is projected to quadruple by 2027. In parallel, 1α nm production at Micron’s OMT (One Mega Taiwan) operations will be reduced over the quarters. Overall, there are no plans to increase Micron’s total production capacity for LPDDR4 and DDR4 DRAM.
The equipment and tools for the new LPDDR4 and DDR4 production lines at Fab 6 will come mainly from the OMT operations, supplemented by additional equipment needed for process upgrades. After the transfer of production lines from OMT to Fab 6, TrendForce expects the share of DDR4 products in Micron’s overall DRAM output to shrink to around 7% in 2026, with this figure declining further in the coming years. From the perspective of the broader DRAM industry, given that demand from applications such as networking remains strong, TrendForce projects that DDR4 products will continue to be in short supply in 2026 and that prices will remain on an upward trend.
Looking ahead, Micron’s global production capacity strategy will feature a clear division of labor: OMT will be dedicated to manufacturing DDR5 and HBM products, while Fab 6 will specialize in memory products with long lifecycles and relatively low demand quantities.
