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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Nano Dimension Opens Essemtec U.S. Headquarters Amid Strong Demand

10/26/2026 | Nano Dimension
Nano Dimension Ltd. announced that its Essemtec business unit has relocated its U.S. headquarters to a new facility in Woburn, Massachusetts, reinforcing its established presence in the United States and supporting its continued business growth.

Microscreen Continues U.S. Expansion with New Baltimore Manufacturing Facility

10/20/2026 | Microscreen
Microscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, has opened a new manufacturing facility in Baltimore, Maryland.

TI Introduces ADC for Faster Telemetry in AI Data Centers

10/12/2026 | PRNewswire
At the Open Compute Project (OCP) Global Summit, Texas Instruments (TI) debuted the first analog-to-digital converter (ADC) to enable 24/7, low-power, event-based remote monitoring at nanosecond resolution.

Elephantech to Open Toyosu Advanced Packaging Center

10/08/2026 | Elephantech
Elephantech Inc. announces plans to commence operations at its new Toyosu Advanced Packaging Center (Toyosu APC) in March 2027.

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power Innovation

09/04/2026 | Siemens
Siemens announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor technologies, has adopted Siemens’ Precision FPGA Synthesis for its field-programmable gate array (FPGA) development initiatives.
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