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As per the SNS Insider, “The flexible PCB market size was worth $27.12 billion in 2025 and is projected to reach USD 88.3 billion by 2035, growing at a CAGR of 12.52% over 2026–2035.”
Increasing Demand for High-Performance Electronics Across Different Sectors to Boost Market Growth Globally
The key factor that drives the growth of the flexible PCB market is a continuous demand for shrinking the size of electronic products. The increasing need for smaller phones, folding screens, and wearables results in consumer electronics manufacturers adopting flexible PCBs capable of being curved and placed in non-linear configurations. The growth of the electric vehicle industry, ADAS, and telematics creates the requirement for a higher FPCB content per vehicle because there is a need for increased density wiring, which cannot be achieved using rigid PCBs. In addition, the development of implantable devices and wearables requires the use of flexible PCBs.
Key Segmentation Analysis:
By Type
The Double Sided FPCB segment dominated the market with a share of 42% in 2025 due to their affordability and space-saving capabilities, which make them ideal for consumer electronics, automotive assemblies, and industrial applications. Multilayer FPCB segment is estimated to witness the fastest CAGR over 2026 to 2035 forecast period due to the increasing requirement of miniaturization of products globally.
By End Use
The Consumer Electronics segment led the Flexible PCB market in 2025 holding a share of 49% due to the rising consumer demand for lighter and thinner devices such as smartphones, tablets, laptops, smartwatches, and foldable displays globally. The IT & Telecom market is expected to exhibit the highest CAGR between 2026 and 2035 due to the extensive installation of 5G technology globally.
Regional Insights
Asia Pacific was leading the flexible PCB industry in terms of market share with over 74% of global revenue contributions. It was attributed to the presence of an integrated manufacturing system, which houses the largest flexible printed circuit board manufacturers in countries such as China, Japan, South Korea, and Taiwan. Companies like Samsung, Sony, and Foxconn, among others, require flexible PCBs, sourced from the region, for the manufacturing of the latest consumer electronics, including cell phones and other wearable devices.
The highest CAGR will be seen in North America between 2026 and 2035 because there will be continued expansion in the aerospace and defense industries, advancement in medical devices, the rise of 5G technology, and the development of next-generation electronics in cars.
Recent Developments:
2025 (July): Sumitomo Electric Industries (SEI) had made investments of $27.4 million in two different projects regarding its production process for flexible circuit boards at Hanoi, Vietnam through SEI Electronic Components (Vietnam) Co., Ltd. This investment had been made by SEI in order to build up its exporting capacity in response to an increased demand for HDI Flexible PCBs.
2024 (November): Regarding Murrietta Circuits, the technology that was implemented in their production line is called the Excellon Cobra Hybrid Laser system, used for drilling microvias in HDI flexible PCBs using two lasers.
