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Schneider Electric, a global energy technology leader, announced a strategic collaboration with Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, to help define and scale the next generation of AI data centers.
As AI adoption surges, the demands on digital infrastructure are being fundamentally reshaped. This collaboration brings together Foxconn’s unmatched expertise in advanced compute platforms, AI rack integration, and global manufacturing with Schneider Electric’s leadership in power systems, cooling, and energy management. Together, the companies aim to deliver integrated, ready-to-deploy solutions that enable customers to build and operate AI infrastructure with greater speed, efficiency, and predictability across regions. Production will begin later this year.
“At the pace AI is evolving, the industry requires a new model for how infrastructure is designed, built, and delivered,” said Young Liu, Chairman of Foxconn. “By combining Foxconn’s strength in AI systems and global manufacturing with Schneider Electric’s deep expertise in power and energy, we are creating a path for customers to deploy AI capacity at scale—faster, smarter, and more sustainably.”
“AI demand continues to accelerate, and as compute scales to keep pace, the energy behind it becomes a fundamental enabler,” said Olivier Blum, CEO of Schneider Electric. “If we want to scale AI responsibly, these systems must be connected. This is where energy intelligence becomes essential. At Schneider Electric, we are advancing energy tech to build the most efficient and sustainable AI factories by bringing integrated power, cooling, and digital capabilities into AI data centers. Working with Foxconn, we are helping customers build capacity with real speed, resilience, and efficiency, as energy technology partners to an industry that is firmly entering the era of intelligence.”
Through this collaboration, Foxconn and Schneider Electric will co-develop next-generation reference architectures for AI data centers. The partnership will also explore innovations in closed-loop energy optimization, modular power and cooling skids, and standardized design frameworks, creating repeatable, high-performance blueprints for AI factories worldwide. By aligning manufacturing excellence with energy intelligence, the two companies are setting the foundation for a new class of AI infrastructure that is scalable by design, efficient by default, and ready to meet the accelerating demands of the AI era.
