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Advanced Electronics Packaging Digest

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Dymax to Showcase PCB Protection and Thermal-Stress Solutions at SMTA Guadalajara

09/25/2026 | Dymax
Dymax, a global manufacturer of light-curing adhesives and equipment, will exhibit at SMTA Guadalajara, October 7-8, booth 830, where visitors can discover light-curing solutions designed to help manufacturers improve efficiency, reliability, and process performance.

IMI's ATC Lab Brings World-Class Calibration and Testing Expertise to the Healthcare Sector

09/24/2026 | IMI
IMI's Analytical Testing and Calibration (ATC) Laboratory has entered into a strategic partnership with the Karl Group of Companies to bring advanced calibration, testing, and measurement services to hospitals and healthcare facilities across the Philippines.

Catching Up With PCB Technologies’ Issey Ende

09/24/2026 | Dan Beaulieu, D.B. Management Group
There are certain conversations you walk away from knowing you’ve just spoken with someone who truly understands where the electronics industry is headed. That was exactly my experience talking with PCB Technologies executive Issey Ende. I was impressed by Issey’s deep understanding of what customers need. He speaks with the perspective of someone who has spent decades inside the industry, watching the transformation of PCB manufacturing into a highly complex global technology infrastructure.

Latest Episode of Qnity Podcast Series Explores Materials for Mission-Critical Reliability

09/25/2026 | I-Connect007
The second episode of Engineering What’s Next, a podcast series from Qnity, is now available on I-Connect007. The series explores the materials, technologies, and expertise shaping the next generation of electronics. In “Materials for Mission-Critical Reliability,” host Marcy LaRont speaks with Rich Wessel, Industrial Application Leader, Laminates, about the increasingly complex demands placed on materials as electronics move into more challenging and mission-critical applications.

3 Key Takeaways from The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness

09/22/2026 | I-Connect007
As PCB technology has evolved, the structures being evaluated become more complex. But have the methods used to determine their reliability evolved at the same pace? In The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, Bob Neves challenges some long-held assumptions about how the electronics industry evaluates PCB via structures. He draws on decades of reliability experience, and examines not only how we test, but what those tests actually tell us.
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