Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

It’s Only Common Sense: Customers Need Confidence More Than Low Prices

08/24/2026 | Dan Beaulieu -- Column: It's Only Common Sense
It’s a business myth that customers buy primarily on price. This belief has shaped sales strategies for decades, but after more than 40 years working with electronics manufacturers, OEMs, and EMS providers around the world, I have learned this simply is not true. Customers are actually looking for the lowest risk. From AI to advanced manufacturing technologies, we are producing products that would have seemed impossible only a few years ago. Every new product carries enormous expectations, and every supplier becomes an important part of that customer's success. In an environment like this, confidence has become one of the most valuable products any company can offer.

Richardson Electronics to Deliver Energy Storage Solutions to Remote Alaska Communities

08/21/2026 | Richardson Electronics, Ltd.
Richardson Electronics, Ltd., a global provider of engineered solutions for renewable energy and other power management applications, announced that, in collaboration with its technology partners, it will deliver 18 customized battery energy storage systems (BESS) for deployment across seven remote communities in Alaska.

Indium to Showcase High-Reliability Power Device Packaging Solutions at PCIM Asia 2026

08/20/2026 | Indium Corporation
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products that are “Electrifying the Future” at PCIM Asia 2026, August 26-28, in Shenzhen, China.

EIPC Summer Conference 2026: Technical Presentations Tell the Rest of the Story

08/12/2026 | Marcy LaRont, I-Connect007
In early June, the EIPC Summer Conference in Vilnius, Lithuania, featured an impressive group of speakers ranging from PCB suppliers and technical experts to startups and robotics OEMs, the latter of which added a “cool factor” to the meeting’s ambiance with a fully operational, interactive humanoid. After some early coverage of the event, I’m now following up with key takeaways from many of the technical presentations. I regret that I could not cover all speakers in detail, but this will give you a good taste of what you missed in Lithuania in June.

American Standard Circuits to Exhibit at the 2026 Space and Missile Defense Symposium in Huntsville

08/10/2026 | American Standard Circuits
American Standard Circuits will be exhibiting at the 2026 Space and Missile Defense Symposium in Huntsville, Alabama.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in