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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Micron Begins Construction of Cleanroom at Hiroshima Plant to Support Advanced Memory for AI Applications

07/07/2026 | Micron
Micron Technology, Inc. today announced the commencement of construction on a new cleanroom at its Hiroshima plant in Higashihiroshima, Hiroshima Prefecture.

Silex Establishes U.S. Manufacturing Capacity – Acquires Semiconductor Fab in Pennsylvania

07/07/2026 | Silex Microsystems
Silex Microsystems has entered into a definitive agreement to acquire a 200 mm integrated circuit fab in Pennsylvania, USA, from Semiconductor Components Industries, LLC.

onsemi Advances Fab Right Strategy with Agreements to Divest Two Manufacturing Facilities

07/07/2026 | Globe Newswire
onsemi announced it has entered into definitive agreements to divest two manufacturing facilities.

SOMACIS Group Establishes Dedicated MedTech Business Unit with DYCONEX and AIRMEDTEC

07/07/2026 | SOMACIS
SOMACIS Group announces the creation of a new integrated practice combining the expertise of Dyconex AG and AIRMEDTEC Korea Co., Ltd. and AIRMEDTEC GmbH, both known as highly specialized partners for advanced interconnect solutions, into a unified MedTech Business Unit, establishing an integrated operational structure dedicated to high-reliability medical technology applications, effective already since Q2 2026.

Foxconn Czech Tech Day Showcases Cutting-Edge AI, Robotics, and Electric Mobility

07/06/2026 | Foxconn
Hon Hai Technology Group (Foxconn) hosted the Czech Tech Day technology exhibition at its Pardubice facility, showcasing the latest high-tech products shaping the present and future of industry.
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