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Skunk Works® Advances Sensor-Powered AI Fighter Intercept

08/04/2026 | Lockheed Martin
In a landmark step toward the future of airborne autonomy, Lockheed Martin Skunk Works, the U.S. Air Force Test Pilot School (TPS) and industry partners demonstrated sensor-driven autonomy on a fighter aircraft.

RTX's Raytheon Completes Installation of First SPY-6(V)4 Array at Wallops Island Test Site

08/03/2026 | Raytheon Company
Raytheon, an RTX business, has delivered and installed the first SPY-6(V)4 radar array at Surface Combat Systems Center at Wallops Island in Virginia, marking a major milestone for the U.S. Navy's Flight IIA Destroyer modernization effort and the SPY-6 backfit program.

Alpha Circuit Chooses atg Flying Probe Technology for High-speed Electrical Test and Automation

08/03/2026 |
Atg Mycronic GmbH and IEC USA confirm an order for an atg A7a, 8 head, double-sided, high speed, auto-load/unload system, for true “lights-out” operation from Alpha Circuit in Schaumburg, IL.

Mega Circuit Chooses atg Flying Probe Technology for High-speed Electrical Test and Automation

07/31/2026 | atg Mycronic GmbH
Atg Mycronic GmbH and IEC USA confirm an order for an atg A7a, 8 head, double-sided, high speed, auto-load/unload system for true “lights-out” operation from Mega Circuit.

Will Your Vias Survive the Heat? New Book From I-Connect007 Has the Answers

08/04/2026 | I-Connect007
I-Connect007 is excited to announce the release of The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, the newest title in its technical resources library. Written by reliability expert Bob Neves, the book examines one of the industry's most misunderstood topics: how to properly evaluate PCB via structures for assembly process survivability, long-term reliability, and robustness.
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