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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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GSME, Teradyne Announce Strategic Partnership

09/23/2026 | PRNewswire
GS Microelectronics U.S., Inc., a fast-growing semiconductor solutions provider, and Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, today announced a multi‑year strategic partnership to establish a state‑of‑the‑art semiconductor test and evaluation center designed to accelerate customer time‑to‑market.

Apple Executive Chair Tim Cook to Receive Semiconductor Industry’s Top Honor

09/22/2026 | SIA
The Semiconductor Industry Association (SIA) announced Apple Executive Chair Tim Cook has been selected as the 2026 recipient of the chip industry’s highest honor, the Robert N. Noyce Award.

Qnity Joins PHLX Semiconductor Sector Index (SOX)

09/22/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced that it has been added to the PHLX Semiconductor Sector Index (SOX).

SEALSQ, WISeKey Expand Quantum Highway from Silicon to Space

09/22/2026 | Globe Newswire
The SEALSQ–WISeKey Quantum Highway™ is designed to connect specialized centers of excellence rather than concentrate critical technologies in a single location.

AT&S, Marvell Expand Collaboration for Next-Gen AI Infrastructure

09/22/2026 | AT&S
AT&S announced an expanded collaboration with Silicon Valley company Marvell Technology, a leading provider of data infrastructure semiconductor solutions, to increase advanced IC substrate capacity for next-generation AI and cloud infrastructure.
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