Polar's Speedstack Eases Material Identification and Adds Ventec Glass-Free Materials

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Polar’s Speedstack mid-year release adds Ventec Glass-Free materials to online resources, and incorporates improved capability of identifying multi material families in the stack documentation, giving users “at a glance” visual views of material types in a stack.

Ventec’s Pesh Patel commented, “As electronics evolve toward higher performance, smaller form factors, and greater reliability, PCB materials play a critical role. Traditional prepregs and glass-reinforced dielectrics—long the workhorses of multilayer PCB manufacturing—are reaching their limits when faced with today’s demands for high-speed signal integrity, low-loss performance, and advanced thermal management.

Ventec’s pro-bond and thermal-bond Bondply dielectrics are engineered to meet these challenges head-on, delivering solutions for high-performance, high-reliability multilayer PCB stack-ups across demanding markets, including AI computing, data networking, high-speed communications, automotive electronics, and aerospace systems."

Pro-bond and thermal-bond are non-reinforced Bondply materials—available as Resin Coated Copper (RCC) and Resin Coated Film (RCF)—formulated for exceptional electrical and thermal performance. Unlike traditional glass-reinforced prepregs, these materials eliminate micro Dk variability from glass weave, ensuring signal integrity at high frequencies and in designs with extremely fine features.”

Speedstack’s ability to design and document stackups is enhanced by offering the latest material updates from all our material partners. The latest update from Ventec International, combined with Speedstack’s updated facility to highlight material types and families within a stack further strengthens the communication of complex material and stackup requirements from initial design through to prototype and production quantity PCB fabrication.