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Advanced Electronics Packaging Digest

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Scanfil Mysłowice Expands Automation Capabilities to Drive Efficiency and Flexibility

09/17/2026 | Scanfil
Scanfil Mysłowice in Poland has strengthened its manufacturing capabilities with two new Trumpf TruBend Cell 5130 robotic bending systems.

Mobix Labs Secures $1M+ Follow-On Order for Threat-Detection Sensor Subsystems

09/17/2026 | BUSINESS WIRE
Mobix Labs, Inc. , a U.S.-based supplier of advanced connectivity and sensing solutions for national security, announced that it has received a multi-unit follow-on production order in excess of $1 million for advanced RF sensing subsystems from a leading security-technology provider.

Würth Elektronik Receives First TDAP Stage 2 Certificate for EMC Chokes

09/17/2026 | Würth Elektronik
The Würth Elektronik lab at its Quality Design Center Asia in Shenzhen has been awarded the world’s first TDAP Stage 2 certificate for the product “choke for suppressing electromagnetic interference” by VDE Prüf- und Zertifizierungsinstitut GmbH.

Designing for a More ‘Intelligent’ and Connected Future

09/15/2026 | Marcy LaRont, I-Connect007 Magazine
With more collaborative and computationally demanding PCB designs, cloud-based workflows are rapidly moving from possibility to reality. But greater connectivity also raises new questions about data security, intellectual property, and the sharing of design information in an increasingly complex electronics ecosystem. In this interview, Kristin Moyer of the Global Electronics Association explores the benefits and challenges of cloud-based design environments, the growing importance of standardized data transfer protocols such as IPC-1751 and IPC-2581, and why a secure, intelligent data ecosystem will be essential for the future of co-design, automation, and advanced electronics manufacturing.

Qualcomm, Amazon Announce Multi-Generational AI Data Center Collaboration

09/14/2026 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced a multi-generation collaboration with Amazon to enable customized silicon at scale for large-scale AI data centers, working together on AI inference.
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