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Advanced Electronics Packaging Digest

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Follow the Story: Building the Hardware Behind AI

09/24/2026 | Michelle Te, I-Connect007
When TTM opened its new UHDI facility in New York earlier this year, it wasn't simply adding another PCB factory. As the largest circuit board builder in the United States, TTM was investing in technologies that bring PCB fabrication closer to the complex world of semiconductor packaging. The advent of AI helps explain why that matters. The enormous compute power required by AI is pushing chip performance to new levels, but those chips don't operate in isolation.

Catching Up With PCB Technologies’ Issey Ende

09/24/2026 | Dan Beaulieu, D.B. Management Group
There are certain conversations you walk away from knowing you’ve just spoken with someone who truly understands where the electronics industry is headed. That was exactly my experience talking with PCB Technologies executive Issey Ende. I was impressed by Issey’s deep understanding of what customers need. He speaks with the perspective of someone who has spent decades inside the industry, watching the transformation of PCB manufacturing into a highly complex global technology infrastructure.

Filtronic Secures $8M Follow-On Order for mmWave Satellite Payloads

09/22/2026 | Filtronic
Filtronic plc, the designer and manufacturer of advanced RF solutions for the space, aerospace, defence and telecoms infrastructure markets, has secured a follow-on contract with a US-based customer for the design, development and build of prototype units to be deployed on satellites, with a total contract value of $8m (£5.9m).

EMS Market Poised for Strong Growth Through 2035, Driven by Outsourcing and IoT Demand

09/22/2026 | Globe Newswire
The global electronics manufacturing services market reached USD 648 billion in 2025 and is projected to attain USD 1.09 trillion by 2035.

UVJC to Launch NovaJet at WESEMiBAY as Semiconductor Scaling Evolves

09/21/2026 | BUSINESS WIRE
Universal Vapor Jet Corporation (UVJC) is set to unveil NovaJet, the first commercial system built on its proprietary Universal Vapor Jet Printing (UVJP) platform, at the WESEMiBAY Semiconductor Ecosystem Conference and Expo in Shenzhen, China, from 14 to 16 October 2026.
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