Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

10/14/2026 | Chandra Gupta -- Column: Below the Surface
In previous columns, I’ve described the ceramic substrate itself, talking about why material choice matters so deeply in electronics, RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, and stability across temperature and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise. But focusing only on the substrate is a bit like judging a city solely by its geology. Bedrock matters, of course.

Qnity Expands Thermal Management Solutions for AI Memory Cooling

10/13/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced two new advanced memory cooling solutions leveraging Laird™ Graphite-over-Foam (GOF) and Laird™ Thermal Interface Material (TIM) technologies.

Aismalibar to Showcase Advanced Thermal Management Materials at The Battery Show North America 2026

10/07/2026 | Aismalibar
Aismalibar, a global leader in advanced thermal management materials for electronics and high-power applications, will exhibit at The Battery Show North America 2026, taking place October 12–15 at Huntington Place in Detroit, Michigan.

Qnity Introduces High-Temperature Sealing Solution for Semiconductor Manufacturing

10/06/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced Kalrez® 7080 perfluoroelastomer parts, a high-performance sealing solution engineered for semiconductor processes operating at temperatures up to 330°C.

Indium, SMT Thermal Tech to Demonstrate Low-Temp Reflow Energy Savings

10/05/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing (EFX), October 6-8, in Stuttgart, Germany.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in