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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Dymax's Doug Katze introduces Dymax 9016, a flexible UV curing adhesive and encapsulant developed for automotive electronics. He explains how the material accommodates thermal expansion, cures in seconds, and offers chemical resistance, with potential applications in aerospace, defense, and AI hardware.

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I-Connect007 Welcomes Dr. Cody Schoener as Newest Mil/Aero Columnist

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