MacDermid Alpha Electronics Solutions will exhibit at SEMICON India 2026, September 17–19, at Yashobhoomi, the India International Convention and Expo Centre (IICC), in Dwarka, New Delhi. Visitors can meet the company at Booth H6807 to discuss ALPHA® ATROX® CD 560-1, a PFAS-free silver alternative conductive die attach paste for metal leadframe semiconductor packages.
India’s semiconductor manufacturing sector is expanding rapidly under the India Semiconductor Mission, with multiple new manufacturing facilities under development or in active qualification. As regional capacity scales, their engineering and procurement teams will be under increasing pressure to qualify materials that deliver cost stability, regulatory compliance, and proven reliability - particularly as silver price volatility and PFAS requirements increase interest in alternative die attach material options.
A silver alternative must do more than lower material risk. It must support thermal management, bond strength, yield, and long-term field reliability, and it must give engineering, quality, and sourcing teams quantitative data they can act on with confidence.
ATROX CD 560-1 addresses this challenge through an alternative copper-filler approach designed for standard conductive die attach applications in metal leadframe packages. Manufactured with no added PFAS, the material supports high-throughput automated dispensing, strong adhesion to copper and pre-plated leadframes, low outgassing, and MSL-1 performance with zero delamination in qualified package designs.
In testing with a 2 × 2 mm bare silicon die on copper leadframes, following a one-hour cure at 175 °C, ATROX CD 560-1 achieved die-shear values of 13.5 kg at 25 °C and 3.5 kg at 260 °C. These results provide engineers with measurable room-temperature and elevated-temperature performance benchmarks for comparative material evaluation.
For process engineers, the proof starts on the line. Teams can evaluate dispense behavior, bondline consistency, void control, and adhesion using x-ray, scanning acoustic microscopy (SAM), and cross-section analysis. For quality and sourcing teams, the same results support a clearer discussion about supply risk, cost exposure, and package reliability.
“India’s semiconductor ecosystem is scaling rapidly, and customers need materials that support both innovation and manufacturing discipline,” says Senthil Kanagavel, Director of Standard Die Attach at MacDermid Alpha Electronics Solutions. “ATROX CD 560-1 provides engineering and sourcing teams with a structured approach to evaluating a silver-alternative die attach material manufactured with no added PFAS, while keeping reliability, yield and process control at the center of the decision. With regional application engineering support available across Southeast Asia and the Indian subcontinent, we can assist customers throughout the qualification program, from dispense Design of Experiments (DOE) through Approved Vendor List (AVL) entry.”
At booth H6807 at SEMICON India, MacDermid Alpha technical specialists will discuss how ATROX materials support standard die attach programs and broader semiconductor assembly needs. Attendees can review application fit, qualification considerations, and technical data for PFAS-free silver alternative die attach evaluations. Visitors can also explore the Micromax™ portfolio, including LTCC materials for high-reliability telecommunications and defense applications, passive component materials, and GreenTape™ solutions supporting probe card reliability.
Discover how ALPHA ATROX CD-560-1 and MacDermid Alpha’s application expertise can support your die attach evaluation and qualification requirements at SEMICON India 2026.
