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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Mobix Labs Secures $1M+ Follow-On Order for Threat-Detection Sensor Subsystems

09/17/2026 | BUSINESS WIRE
Mobix Labs, Inc. , a U.S.-based supplier of advanced connectivity and sensing solutions for national security, announced that it has received a multi-unit follow-on production order in excess of $1 million for advanced RF sensing subsystems from a leading security-technology provider.

Advanced Packaging and the New Scaling Walls

09/17/2026 | Chetan Arvind Patil, Marvell Technology
Advanced packaging is becoming the foundation for semiconductor scaling in the AI era. As monolithic processors encounter practical limits around reticle size, yield, memory bandwidth, power, and cost, the industry is moving toward architectures built from multiple compute dies, HBM stacks, I/O chiplets, and heterogeneous packaging solutions. The result is that semiconductor scaling is no longer determined only by how much functionality can be integrated into a single die, but by how much silicon can be integrated efficiently within a package.

GSME Joined TSMC OIP Value Chain Alliance in North America

09/16/2026 | PRNewswire
GS Microelectronics U.S., Inc. (GSME), a leading semiconductor solutions provider, announced it has officially joined TSMC's Open Innovation Platform® (OIP) Value Chain Alliance (VCA) as a member partner in North America.

Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection

09/16/2026 | PRNewswire
Spirox, hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications.

KYZEN to Feature MICRONOX Chemistries at IMAPS Symposium 2026

09/15/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 28-October 1 at the Encore Boston Harbor in Everett, MA.
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