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Advanced Electronics Packaging Digest

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Starlab Space and Arkwright Space Advance In-Space Electronics and Semiconductor Manufacturing

09/29/2026 | Starlab
 Starlab Space LLC, the commercial space station developer expanding access to low Earth orbit, announced an agreement with Arkwright Space to advance in-space manufacturing of semiconductors, electronics, devices and integrated systems. The collaboration will provide Arkwright Space with access to Starlab’s commercial platform to develop capabilities designed for the production and support of critical systems in space. 

Zuken Adds Dashboard to Harness Builder 2027 for Wire Harness Production Tracking

09/29/2026 | Zuken
Zuken announced Harness Builder 2027 for E3.series, adding Dashboard to give manufacturing teams a shared view of wire harness production progress.

VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore

09/28/2026 | Globe Newswire
VisionPower Semiconductor Manufacturing Company Pte. Ltd. (VSMC), the joint venture established in September 2024 by Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors N.V., marked the grand opening of its first 12-inch (300mm) fab in Tampines, Singapore.

ATLANT 3D, UC Berkeley Sign MoU to Advance Materials Innovation and A-HUB California

09/28/2026 | PRNewswire
ATLANT 3D and the University of California, Berkeley (UC Berkeley) have signed a Memorandum of Understanding to advance research, technology development, and innovation infrastructure in California.

Wolfspeed Expands 200 mm Silicon Carbide Portfolio with New Premium Power Substrates

09/28/2026 | BUSINESS WIRE
Wolfspeed, Inc., a global leader in silicon carbide (SiC) technology, announced the commercial availability of its new Premium 200 mm n-type silicon carbide substrate, expanding its 200 mm SiC materials portfolio with a higher-quality starting material designed to improve yield through reduced defects and greater wafer-shape stability.
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