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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Asia-Pacific AI Infrastructure Spending to Reach US$32B by 2030

11/10/2026 | IDC
AI infrastructure spending in the Asia/Pacific excluding Japan and China (APeJC) region is entering its next phase of growth.

NOTE Finland Joins PIA to Strengthen Defense Industry Collaboration

11/09/2026 | NOTE
NOTE Finland provides electronics manufacturing services ranging from prototypes to series production, including PCBAs and complete box-build products.

onsemi, Czech Ministry Agree to End SiC Expansion Project

11/09/2026 | onsemi
onsemi and the Czech Ministry of Industry and Trade confirmed that they will not proceed with the planned expansion to add end-to-end silicon carbide (SiC) production at onsemi's Rožnov pod Radhoštěm site, first announced in June 2024.

Applied Materials to Increase its Strategic Investment in BE Semiconductor Industries

11/06/2026 | Applied Materials
 Applied Materials, Inc. announced it is increasing its investment in BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry, to approximately 20 percent of Besi’s outstanding shares. The share purchase would add to Applied Materials’ current investment in Besi, which Applied initially made in April 2025.

Curtiss-Wright Invests $30M to Expand Texas Operations

11/03/2026 | Curtiss-Wright Corporation
Curtiss-Wright Corporation announced a $30 million capital investment to expand operations at its Round Rock, Texas facility, to strengthen its manufacturing capabilities in support of critical nuclear energy and industrial applications.
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