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Advanced Electronics Packaging Digest

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Suggested Items

From IPC Standards to Practical DFM

10/21/2026 | Marcy LaRont, I-Connect007
DFM seems like common sense: If we know the rules a PCB must meet, why not check the design against them before it ever reaches the factory? In practice, of course, it’s not quite that simple. I caught up with Susan Kayesar, product manager at Siemens and longtime contributor to Global Electronics Association standards activities, to talk about an ongoing effort between Siemens and the Association to translate IPC requirements into practical, software-based DFM checks.

Building Consistent Reflow Results Across Automotive Manufacturing Sites

10/20/2026 | Miles Moreau, KIC
As automotive electronics production shifts among global locations, replicating a successful assembly process isn’t as simple as moving the equipment or copying a recipe. Miles Moreau of KIC talks with Nolan Johnson about the challenges of maintaining consistent reflow performance across different lines and facilities. They explore what manufacturers can learn from better process data, where optimization can make a difference, and why experienced engineers still play a critical role in getting the process right.

Faster BGA Warpage Processing Without Shearing or Painting

10/21/2026 | Chris Gastaldo and Neil Hubble, Akrometrix
The process of measuring BGA samples for thermal warpage is subject to industry standards from both JEDEC, in JESD22-B112C and JEITA ED7306. Additionally, these standards establish allowable warpage values based on ball size and ball pitch, for the JEDEC standard, pass/fail further established in JEDEC SPP-024.3 Standard practice in these standards for measuring BGA warpage is to remove the solder balls in order to measure only the substrate surface. However, as both ball size and package thickness decrease, the practicality of removing solder balls without altering the sample shape has become increasingly challenging.

Apple Expands US Manufacturing Partnerships with Qnity for iPhone 18 Pro Camera Technology

10/20/2026 | BUSINESS WIRE
Apple® announced new and expanded partnerships with American companies that are supplying critical materials and components for iPhone Duo® and iPhone 18 Pro.

Stop Inspecting AI and Start Understanding

10/20/2026 | Sean Patterson, CrossGen AI
If you are new to a PCB shop, there is a good chance your first real job is at the back end of the line. Maybe you run the AOI station or pull boards at final inspection and flag the ones that do not pass. I want you to notice something: Every board you reject has already been built. The copper was plated and the layers pressed before you ever saw it. Your job is to catch the mistake, not to stop it from happening. That is a problem, but not with you. Unfortunately, it has always been the way most shops go about achieving quality.
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