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Advanced Electronics Packaging Digest

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onsemi, Sungrow Advance Energy Storage with SiC Technology

10/19/2026 | onsemi
onsemi announced that Sungrow, a global leader in renewable energy technology, has adopted onsemi’s latest EliteSiC silicon carbide (SiC) hybrid power module technology for the Sungrow PowerTitan 3.0 energy storage platform.

Polar, IC-Link by imec Partner on 8-Inch GaN Manufacturing

10/19/2026 | Polar Semiconductor, LLC
Polar Semiconductor, LLC (Polar), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, and IC-Link by imec, imec’s design and manufacturing service, announced they are collaborating to provide 8-inch production of enhancement-mode (e-mode) GaN devices to serve critical markets such as AI data centers, automotive, aerospace & defense, and the industrial grid.

Infineon, Wolfspeed Sign 200mm SiC Wafer Supply Agreement

10/15/2026 | Infineon
Infineon Technologies AG and Wolfspeed, Inc. have signed a new multi-year supply agreement for 200-millimeter silicon carbide (SiC) wafers, transitioning Infineon's existing Wolfspeed supply relationship from 150-millimeter to 200-millimeter substrate technology.

LITEON September Sales Rise 22% on Strong AI and Cloud Demand

10/14/2026 | LITEON Technology
LITEON’s consolidated revenue for September reached NT$18.8 billion, representing a 22% Y-o-Y increase.

Flex Acquires EPC Power to Expand AI Data Center Power Solutions

10/14/2026 | Flex
Flex announced that it has completed its acquisition of EPC Power, a leading provider of intelligent power conversion solutions for data center and grid applications.
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