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Advanced Electronics Packaging Digest

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Circuit Mind Announces $25M in Funding to Accelerate the Rise of Electronic Design Intelligence

10/28/2026 | Globe Newswire
 Circuit Mind, the AI platform that enables enterprise electronics teams to automatically design, verify, and optimize circuit boards, announced $25 million in new financing, bringing its total funding to $33.4 million.

Intel to Acquire Classiq to Create a Full-stack Quantum Computing Platform

10/28/2026 | Intel
 Intel Corporation announced that it has entered into a definitive agreement to acquire Classiq, a leading provider of quantum computing software. The combination of Classiq’s synthesis platform with Intel’s spin-qubit manufacturing and existing software would create a user-friendly full-stack quantum computing platform, enabling the promising technology to mature into a mainstream computing business.

Siemens Expands NVIDIA AI Collaboration for 3D IC Power and Thermal Challenges

10/27/2026 | Siemens
Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with NVIDIA.

3 Key Takeaways: Understanding the Promise and Practical Limits of ELIC

10/26/2026 | I-Connect007
As semiconductor packages become smaller and more complex, PCB designers face increasing pressure to accommodate higher interconnect densities within tighter space constraints. Every layer interconnect (ELIC) technology offers a way to overcome some of the limitations of traditional HDI construction, but achieving greater density introduces new challenges in fabrication, reliability, and cost. In his white paper, ELIC: Every Layer Interconnect—The Promise, the Pain, and the Practical Limits, ASC President and CEO Anaya Vardya examines the advantages of ELIC architecture, the manufacturing challenges that accompany it, and the design decisions that determine whether a board can be produced reliably at scale.

Silicon Carbide and Gallium Nitride Play Growing Role in Electronics Design, Manufacturing and Supply-Chain Strategy

10/26/2026 | Global Electronics Association
Silicon carbide (SiC) and gallium nitride (GaN) power devices are expanding their role in electronics, with implications extending beyond component selection to product design, manufacturing capability and supply-chain planning, according to new research from the Global Electronics Association and Accuris, a provider of engineering intelligence and electronic-component data.
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