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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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MacDermid Alpha to Showcase SiC Power Module Technology at electronica 2026

11/03/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will exhibit at electronica 2026 (November 10–13, Messe München, Booth C2.654), showcasing its upcoming BondPad technology, an Argomax® film-laminated copper-foil solution for sintered die-topside attach in high-power, high-reliability silicon carbide (SiC) packages.

onsemi to Acquire Ferric

11/03/2026 | onsemi
onsemi announced that it has entered into an agreement to acquire Ferric, Inc., an innovator in integrated voltage regulator (IVR) technology, for $600 million in cash, plus up to $175 million in contingent consideration upon achievement of certain revenue milestones.

TECO, Foxconn Showcase NVIDIA-Based Modular Data Center

11/02/2026 | Foxconn
Teco Electric participated in Foxconn Technology Day for the second time, focusing on its Modular Data Center (MDC ) concept developed in cooperation with Foxconn. The MDC is based on the NVIDIA DSX POD reference design.

Flex Reports Q2 FY2027 Sales Growth of 25%, Record Adjusted EPS

10/30/2026 | Flex
Flex announced results for its second quarter ended September 25, 2026.

Kratos Wins $33.6M NASA Contract for Nuclear-Powered Spacecraft System

10/30/2026 | Globe Newswire
Kratos Defense & Security Solutions, Inc., a leading technology company in the defense, national security, and space domains, announced a $33.6 million contract award to design, build, and deliver the power conversion system for NASA’s Space Reactor-1 Freedom.
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