-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC APEX EXPO 2010: Exhibits Preview IV
March 16, 2010 |Estimated reading time: 14 minutes
— IPC APEX is coming up April 6–9 at the Mandalay Bay Convention Center in Las Vegas. This preview includes electrical test products from ECT, inspection systems from ORPRO and VJ Technologies, solder paste inspection on-printer from Milara and CyberOptics, Seho’s soldering equipment and FCT’s solder pastes, consumables and nozzles from Count On Tools, rework from VJ Technologies, and process control software from Valor, as well as various PCB assembly machinery from Seika.
Follow all of the happenings on the APEX show floor with SMT’s Website, and via our Twitter feed, www.twitter.com/surfacemount. Also check out our other APEX previews and coverage.
ECT’s CPG to Feature Electrical Testing
Everett Charles Technologies (ECT) Contact Products Group (CPG) will feature the latest electrical test technologies, demonstrating products and answering electronics test questions. Bead Probe Technology uses small raised bumps to place test points directly on the PCB’s copper traces. These beads then become the test point targets for use during in-circuit testing. ECT supplies wire-harness probes to North American automotive and major appliance manufacturers. ECT probes perform continuity testing, push testing, presence checking, terminal push-out and other wire harness tests. ECT’s versatile line of battery interconnect probes provide design flexibility to match any performance, cost and assembly requirements. The PogoPlus Series addresses loaded board testing, featuring an enhanced version of the company’s bias-ball design to virtually eliminate false opens. ECT offers a full range of sizes and tip styles to accommodate all manners of testing requirements. LFRE probe tips (LFRE 25, LFRE 1, LFRE 72) are manufactured with ECT’s MicroSharp and plated with ECT’s proprietary LFRE plating technology, offering long lasting resistance to contamination and tip sharpness and contact integrity. Ostby-Barton’s complete line of test probes will be highlighted at the show, with more than 1,100 standard and 4,300 custom models. Ostby-Barton test probes are designed for high-reliability testing and/or connecting of circuits, components, assemblies, PCBs, ICs and similar applications. OB Pylon products offer a full range of replaceable probes from 0.050" to 0.250" test centers. Additionally, a series of Non Replaceable (permanent mount by soldering, press fit or epoxy) is available ranging from 0.025" to 0.300" test centers including the 45 Amp Brute series. Everett Charles Technologies, a subsidiary of Dover Corporation (NYSE: DOV), www.ectinfo.com, Booth 1283.
ORPRO Vision Demos Inspection Systems
ORPRO Vision will demonstrate its Symbion series of paste and component inspection systems and a new tabletop prototype AOI system. Symbion S36 Plus delivers full 3D component AOI, pre-reflow and post-solder. The Symbion S36 Plus uses ORPRO Vision’s application software to minimize programming complexity and reduce production debugging efforts. The new software meets the requirements of easy and fast programming independent from process variations like PCB and component colors, alloy type, etc. More tests can now be refined and debugged using the intuitive DPIX interface. This simple to use interface allows the user to see the effect of changes in real time, without repetitive testing. These features are fully complemented by ORPRO Vision’s off-line programming and optimization concept, newly extended with a one-click learning feature for the built-in-intelligence learning tests: refine and debug programs off line without any impact on production throughput. Features include low cost per board inspection and robust hardware architecture, customized board handling, data exportation, copy-exact capability and high-end features such as logical operands, OCR, OCV, etc. For paste deposition analysis, the Symbion P36 Plus meets speed and precision requirements with the patented Parallel Optical Path (POP) head structure. The Symbion P36 Plus creates dual, fully independent laser-driven channels to analyze 100% of the board by complementary 2D and 3D methods, coupled by software. The Symbion P36 Plus also uses ORPRO Vision’s newly developed software for easier and more reliable set up, capable of handling various paste deposit shapes and sizes using new features like bare board scan, package specific attributes, etc. Features include a common database with component AOI equipment, printer interface for data exchange, printer optimization and real-time SPC tools. The company will feature a new Table-Top prototype AOI at APEX, with full 3D inspection using 5 intelligent digital cameras, proprietary single-point illumination hardware, a newly developed set of software and an open-cluster native database. The new image acquisition technology will be discussed at the show. ORPRO Vision, www.orprovision.com, Booth 2365.
SEHO Systems GmbH Displays Latest Soldering Equipment
Depending on the application, the GoSelective light is designed for stand-alone operation or as an in-line system to be integrated into a fully automated production line. During the process, the assembly remains on its position. The various workstations — fluxer unit, and preheating and soldering units that are mounted on a high-precision axis system — successively approach the solder joints. This allows flexible processing of assemblies up to 500 × 500 mm with reproducible results. The GoSelective light suits small- and medium-sized production volumes. If throughput requirements increase, the system can be upgraded with an additional coordinate fluxing unit and/or preheating module. The GoWave 1030, also at APEX, is a powerful soldering system for those entering mass-soldering applications. The system is suited for soldering of small- or medium-sizes batches and also provides an economical solution for universities, schools and laboratories. The system has a fluxing module, an efficient and powerful preheater, an innovative soldering area, and microprocessor control. The redesigned system features a longer reflection tunnel over both the preheat area and the solder pot to promote better energy transfer to the board. The cabinet also has been redesigned as one unit. A new spray flux nozzle uses HVLP technology to control the quantity and spray pattern of the flux. The new GoWave 1030 boasts a new PCS 707 touchscreen controller and USB interface. To make service easier, the service points for the fluxer and compressed air are now located directly at the inlet section of the machine. The enhanced system also features a new switch cabinet and updated pump motor, as well as a redesigned exhaust area and conveyor system. The PowerRepair soldering system is designed for professional de-soldering and soldering of through-hole components to PCBs. The system features mini-wave soldering technology, which is able to realize de-soldering/soldering of components with a high number of pins and with different pin rows (connectors). It also can de-solder and solder components with high thermal mass (thick pins, multilayer boards etc.), and is compatible with all lead-free solder alloys. The PowerRepair’s soldering nozzle ensures a high energy transfer rate, even for high-temperature applications. The system also features short repair cycles, even for high-mass components, and guarantees low thermal stress for the PCB and components. All soldering parameters on the PowerRepair are programmable. SEHO, www.sehona.com, Booth 259.
Seika Machinery Inc. to Feature Machinery
The Solder Paste Recycling Unit enables approximately 90% of waste solder paste to be recovered as solder bar. The system provides a major decrease in disposal costs for factory waste, a reduction in CO2 emissions, and reduced costs for solder bar as a result of recycling waste. The recycling unit enables selection of manual or automatic mode. The Anritsu 3D Solder Paste Inspection System features high-resolution and vertical (1 µm) inspection at 33 cm2/sec at 20 µm resolution; 13.8 cm2/sec at 10 µm resolution. Easy programming and maintenance in program generation is accomplished in approximately five minutes and consistent results are provided, regardless of the operator. An automatic calibration function eases maintenance; SPC software is included for detailed analysis and traceability.McDry Electronic Drying Storage Cases provide low-humidity storage without use of nitrogen. Humidity is removed from the cabinets by a zeolite desiccant, which is automatically recycled by the unit and does not require replacement. McDry units come in 1 and 3% RH models for proper storage of moisture-sensitive materials.Sawa Ultrasonic Stencil Cleaners are widely used in the Japanese electronics industry to ensure high yields when screen printing solder paste onto PCBs. Normal cloth wipe cleaning of stencils cannot completely remove solder paste especially in fine-pitch applications because a small amount of solder balls have a tendency to adhere to the aperture corners. Sawa Stencil Cleaners are able to completely remove solder paste using ultrasonic vibration and require no special solvents. They are effective with solvents, including water-based isopropyl alcohol.Sayaka’s CT23NJ Series is comprised of fast and accurate stand-alone PCB routers, with a CCD camera and sophisticated image-processing software. Sayaka Routers provide stress-free depanelization with a fixture-based dust vacuum system. The routers provide clean and precise depanelization for densely populated PCBs, and the advanced image-processing software offers point-and-click operation for programming router paths. HIROX 3D Digital Microscopes are dedicated digital microscopes optimized for the characteristics of the imaging sensor — a flat, 2D array with a known readout rate, response curve, pixel size, etc. Because the HIROX microscopes have been designed only for digital imaging, no compromises have been made to accommodate the eye’s optics. However, the systems are, in fact, often able to take advantage of sight physiology and visual signal processing to provide unique observational capabilities, i.e. 3D rotational microscopy.YJ Link’s SPI Not Good (NG)/Good Buffer is designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission, RS-232C interface with SPI, and NG PCB anti-touch verification. This method provides increased line efficiency and requires only minimal space for equipment. Using the SPI NG/Good Buffer, there is no need to filter NG PCBs and SPI operates normally, even during NG PCB verification. YJ Link’s AOI NG Buffer stacks NG PCBs and pushes good PCBs to the next AOI inspection process. This system also features shock-free and noncontact power transmission. Both systems feature a SMEMA interface, a slim, round design, adjustable stacking, a LED tower light and touch screen operation. Seika Machinery, Inc., www.seikausa.com, Booth 407.
VJ Technologies to Showcase Rework and X-ray at APEX 2010
On the Rework side, VJ Technologies will illustrate advanced Rework with Solder Scavenging performed by the Summit Series and 400 Series. The Summit 1800 Performance Rework Platform incorporates features for high-level, semi-automatic surface mount and microelectronics rework. The 400 Series Value Rework Platform is capable of addressing challenging lead-free rework applications. The 400 Series is configurable with an arsenal of recently developed Rework solutions for site dressing, BGA rework and Through-Hole rework eliminating copper dissolution. Extensive field experience and user feedback have resulted in the development of Rework systems that exceed current and future industry requirements. SierraMate Rework software with intuitive 1-2-3-GO operator interface and Auto Profile maximizes ease of use and throughput, while maintaining the inherent capability to rework the most complex area-array components (BGAs, micro BGAs, flip chips, CCGA, etc.). VJ Technologies will also display its IR-4 Preheater, designed to work in conjunction with hand soldering and desoldering tools. The IR Preheaters were developed for manual rework preheaters or for use with equipment such as selective soldering systems to help eliminate board warping prior to rework with hot air tools, or assist underpowered rework systems that do not have large area, effective bottom heating. IR Preheaters feature robust, flexible board fixtures that are easy to adjust. Spring-loaded board clips allow thermal expansion without bending boards. Many PCB tooling options are available, including four-sided board support, bottom board support, and extended reach board clips to accommodate regularly shaped boards.On the X-ray side, VJ Technologies will display the Vertex 130 X-ray inspection platform capable of 2D and 2D off-axis X-ray inspection. An all-purpose X-ray inspection system with a large 20 × 24″ inspection area, configurable for manual and automatic X-ray examination. NavCam, an on-board sample navigator, provides easy-to-use product positioning, making the Vertex highly suitable for production environments and capable of addressing a wide range of applications. Vertex 130 is configured with the latest innovative Nexus 300 X-ray software and analysis tools, providing intuitive manual operation or automated inspection routines. Nexus 300 image processing offers Advanced Defect Enhancement, BGA Analysis, Area Analysis and Feature Masking software modules. The Vertex 130 performs standard routine or non-standard inspection routines and satisfies even the most demanding requirements. VJ Technologies, www.vjelectronix.com, Booth 2059.
Valor to Feature Process Management Software
Valor Computerized Systems, Inc. will show a complete interoperable manufacturing execution suite designed to integrate solutions that assist manufacturers in design, planning, monitoring, control, scheduling, box build, traceability, test and rework processes. The product suite is set to provide a long awaited software solution that encompasses the entire production process, from the receipt of goods into the production inventory locations, through to PCA assembly and test, full system assembly and test, right through to the final packing of the finished goods ready for shipment. The components of the Valor software solution include vPlan for complete SMT programming and data management, multi-vendor line balancing, program optimization and process setup documents; vManage, for complete SMT/PCB material control, material verification and traceability, and warehouse management, including a unique just-in-time Kanban material delivery module using real-time consumption as part of shop-floor management solutions; and vCheck, a complete PCB quality management solution with AOI/ICT direct interfaces, enforced WIP tracking, repair loop monitoring and control, paperless factory, including synchronized delivery of detailed work instructions for board and system level assembly, and full quality data collection with a business intelligence infrastructure, enabling Web based dynamic reporting for full System Genealogy. Further, Valor will be demonstrating the Trilogy 5000 design-for-manufacturing (DFM) analysis software, supporting full virtual “prototyping” of the design of an electronics product. The Trilogy 5000 software enables fast off-line simulations to validate physical design characteristics against assembly and test constraints before a first article or pilot run. Valor users can validate critical manufacturing processes in advance, such as solder-joint formation, test-point accessibility, pick-and-place constraints, rework accessibility, and much more. Valor Computerized Systems Inc., www.valor.com, Booth 2228.
FCT Assembly Displays Range of New Pastes
NL930PT is a no-clean, lead-free, halide-free pin-probable solder paste. The paste leaves clear residue yet can print down to low surface area ratios consistently. Combined with SN100C, this solder paste produces cosmetically appealing solder joints. NL932 no-clean, lead-free, halide-free solder paste features excellent solderability, enabling the process to handle the most difficult wetting requirements. It also improves stencil life and provides superior cosmetics, especially when using SN100C. The lead-free paste offers excellent print consistency with high process capability index across all board designs, as well as excellent wetting characteristics on all pad finishes. WS888 is FCT’s newest lead-free water-soluble solder paste. The paste provides excellent wetting on all surface finishes with consistent printing down to low surface area ratios. Combined with SN100C, this solder paste produces cosmetically appealing solder joints and can be run in RH of 30 to 65% without slump. FCT’s WS159 water-soluble solder paste offers good solder spread and wetting. It also features print volume consistency down to 12 mm circles and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. WS159 is fully cleanable, with a wide cleaning process window. SN100C Bar Solder is used in thousands of wave soldering machines globally and has proved reliable in products exposed to severe service environments. FCT Assembly holds a licensing agreement to manufacture the Nihon Superior SN100C lead free solder in Canada, the United States and Puerto Rico, and Mexico. FCT Assembly, www.fctassembly.com, Booth 2317.
Count On Tools Exhibits Nozzles and Consumables
Count On Tools will be introducing their latest developments in SMT nozzles and consumables, as well as the launch of their new Website with online store. This year marks the tenth IPC Apex Expo for Count On Tools. To commemorate this, Count On Tools is offering a $1000 sweepstakes contest. Every attendee who stops by the booth will have a chance to enter to win a $1000 gift certificate for products and services. Other prizes include PB Swiss Tools apparel, hand tools, tool sets, discount coupons, and more. New product lines to be showcased at the event include Ace KISS (Bullet) Selective Soldering Nozzles; Pillarhouse AP-1 Selective Soldering Nozzles; Mydata Midas/Hydra tools and consumables; Panasonic CM402 & CM602 nozzles; Mirae MX/MPS nozzles; Hitachi GXH nozzles; Samsung CP-series nozzles; Casio VCM/VX series nozzles; Fuji NXT & XP nozzles; Juki 500-series nozzles; Universal Instruments Genesis, Advantis (Lighting), and Quadris nozzles; and a broad assortment of custom nozzle designs for odd-form components. Count On Tools will also showcase its Free Nozzle Promotion, where new and existing customers can have the opportunity to try their products before they buy them. Count On Tools, www.cotinc.com, Booth 1870.
Milara Integrates CyberOptics’ 3-D Inspection Head on In-line Printer
Milara Incorporated integrates the CyberOptics 3-D post-print inspection head on its TouchPrint Digital TD2929 in-line printer. The integration of CyberOptics’ SPI sensor head into the TD2929 achieves 100% 3D solder paste inspection (SPI) within a solder paste printer without slowing the print cycle time. Coupling CyberOptics’ measurement accuracy and speed with Milara’s high-speed, precision print process will ensure consistent, reliable prints. CyberOptics’ patented, on-the-fly 3D inspection head is manufactured as an integrated assembly with no moving parts, thus requiring no calibration in the field. The system features telecentric optics for accurate X/Y measurement and robust board warp handling, and is calibrated in a factory clean room through the entire X/Y/Z measurement range. Milara’s TD2929 is a fully automatic in-line printer that offers new SimuTech Technology. The system incorporates a dual overhead camera gantry system with twin conveyors which allows for concurrent processing capability (print & inspect, bottom side clean & inspect, inspect & inspect, print & dot dispense, inspect & dot dispense). The dot dispensing option (first introduced in 2002) was combined to offer clients flexible solutions using cutting-edge Piezo dispensing technology and high-speed operation. The system also features dual digital servo positioning loop for highest possible alignment accuracies, paste bead dispense while printing, linear servo motion technology and heavy-duty construction for extra stability in multifunction operation. Milara Inc., www.milarasmt.com, Booth 959.
Join the PennWell SMT Group on LinkedIn
Become a Fan on SMT's Facebook Page
Post your electronics manufacturing, SMT-related material to the #SMT community on Twitter. Use the #SMT hashtag.