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New Thermal Management Products
October 13, 2009 |Estimated reading time: 4 minutes
— Whether metal preforms, two-part epoxies, gap filler pads, films, or other materials, these products are designed to dissipate heat away from thermally sensitive or high-heat components to heatsinks, copper planes, the air, or other thermal interface materials (TIMs).
Low Modulus Gap Filler PadSarcon GR-Sd is designed to be the lowest compression force thermal gap filler, transferring heat to a heatsink in applications that require extremely low force on the component as well as a high adhesion characteristic. This gap filler pad offers a thermal conductivity of 1.4 W/m°K with a low thermal resistance between 1.72 and 2.33°Cin2/W depending on sheet thickness. Sarcon GR-Sd easily conforms to protrusions and depressions on components to make complete, reliable physical contact. The gap filler pad is available in 2.5- and 5.0-mm-thick sheets up to a maximum 200 mm x 300 mm dimension. The physical characteristics of this product also allow it to act as a low-pressure vibration absorber and electrical isolation material for bare leaded applications. Fujipoly, http://www.fujipoly.com.
Thermal Management Application Notes The application note, “Thermoelectrics vs. Compressors in Climate-Controlled Electronic Enclosures,” describes the role of thermal management in numerous market segments. This application note compares and contrasts the two cooling technologies to provide the best solution for a climate-controlled enclosure application. Comparisons of efficiency, reliability, control accuracy, as well as installation and maintenance, demonstrate that a thermoelectric solution has significant advantages over conventional compressors. Air conditioners using thermoelectric assemblies (TEAs) are often considered as an alternative to conventional vapor-compression systems for enclosure cooling. Because a TEA core is compact, robust, and completely solid-state, the inherent reliability of such a system is attractive to engineers and end-users. However, there is an inherent reluctance to choose the thermoelectric system due to preconceptions about energy efficiency and unfamiliarity with the technology. A TEA has considerable advantages over a comparably-sized, compressor-based solution in climate-controlled electronic enclosures. It cools and heats, offering more precise temperature control than a compressor-based unit; and it is more energy-efficient throughout the temperature range of the application, by 25–95% in cooling and up to 400% in heating. The TEA’s solid-state construction provides advantages in reliability, installation, vibration, and maintenance. Additionally, its smaller size and weight allows easier mounting and less space than a compressor-based unit. Because it operates on DC power, a TEA can be used globally regardless of available AC line voltage and frequency. Using a TEA in climate-controlled electronic enclosures is the ideal solution because of its efficiency, reliability, accuracy, compact design, quietness, and easy installation. Laird Technologies Inc., http://www.lairdtech.com.
Pick-and-place UnderfilmPlaceNBond pick-and-place underfilm technology reduces solder joint fatigue failures. The product was developed to reduce solder joint fatigue failures caused from drop and shock associated with brittle lead free solder joints and reduced joint size due to BGA miniaturization. It can be implemented using an existing SMT line and tape-and-reel feeders. The film is supplied on reel per EIA 481 carrier tape. It has been tested with applications using lead-free solders. No PCB pre-baking or additional cure cycles are required. Residue and solvent free, it requires no post cleaning. It does not migrate, preventing interference with solder, flux, or other SMT components placed in close proximity. The underfilm is reworkable. Alltemated Inc., www.alltemated.com.
Thermal Interface Material for IGBT Modules The Heat-Spring metallic thermal interface material (TIM) was designed and optimized for use with Infineon Technologies AG PrimePACK IGBT modules. Many applications call for a TIM that can easily be placed against a backing plate and a cooling solution. Indium’s Heat-Spring is a soft metal alloy (SMA) developed as a compressible metallic shim that can be used in IGBT mounting applications. Heat-Spring has been tested for the latest PrimePACK configurations with increased number of fasteners and decreased width base plate. Heat-Springs are compressible preforms, allowing for adaptation to irregularities in the mounting surface. They do not contain silicone, do not out-gas, and do not exhibit pump-out. Heat-Springs are stable, easy to handle, and require no special mounting apparatus. They are highly conductive thermally and electrically. Heat-Springs are also made of 100% recyclable and reclaimable metal and are considered a “green” interface material. Indium Corporation, www.indium.com/TIM.
Silicone Thermal Gel Sheets V30Z62MCH sheet-type silicone thermal gel sheets feature excellent control and dissipation of heat in electronic components. Applications include computer internal components such as CPU, motherboards, power transformers, power supply equipment, and electronic parts such as semiconductors that produce heat. These soft gel sheets are sold in a 400 × 400 mm size and are 0.5 to 3.0 mm thick. They are a RoHS controlled substance and are usable over a temperature range of -40° to +200°C; flame retardant UL-94 V-0 approved. There are 5 gel sheets identified as the V30Z62MCH, with thermal conductivity ranges between 1.8 and 6.5 W/m°k. Advanced Antivibration Components (AAC), http://vibrationmounts.com/NewProducts/Gel_Sheets.htm.
Epoxy for Improved Thermal ManagementEP30BN is a two-part boron nitride epoxy adhesive offering improved thermal management of heat-generating components. The medium-viscosity epoxy system has good flow characteristics for bonding, sealing, and potting applications. Featuring high thermal conductivity and excellent electrical insulation properties, the thermal epoxy is designed to optimize heat dissipation of aerospace, defense and microelectronic assemblies with minimal weight penalty. It is formulated to cure at room temperature or more rapidly at elevated temperatures to a tough, thermoset, dimensionally stable plastic. Attractive mechanical strength properties and outstanding chemical resistance are maintained over a -60° to +300°F temperature range. Master Bond, http://www.masterbond.com/prodtype.html#pepoxy.