-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
APEX Product Preview
December 31, 1969 |Estimated reading time: 25 minutes
The 2008 IPC Printed Circuits Expo/APEX/Designers Summit promises close to 450 exhibitors focused on every aspect of PCB assembly from designing boards to final test and inspection, rework, and beyond. Following are some of the soldering systems, materials, inspection tools, cleaning products, pick-and-place systems, and other devices and products debuting on the APEX show floor, April 13 in Las Vegas.
Reworkable Underfill
One-Step Underfill 688 is a non-odorous, low-surface-tension, reworkable one-component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA, and microBGA assemblies. It acts as flux and underfill, and may be applied directly after the SMT printing process and then cured during the standard lead-free reflow process. It boasts excellent capillary action, faster reflow characteristics, rapid cure speeds, and good fluxing action. The product targets fewer process steps and increased throughput, and can be used in mixed-alloy solutions, such as a lead-free BGA on a tin/lead board. AIM, www.aimsolder.com. Booth 875.
No-clean Lead-free Solder Paste
NC-560-LF is a no-clean, lead-free solder paste designed to improve solder joint reliability and printing characteristics. It targets lot-to-lot and stencil printing consistency, along with excellent wetting and good surface tension, minimal residue, thermal stability at high temperatures, 650-850 Kcps +10% viscosity, low beading, and wider process windows. NC-560-LF also leaves a post-reflow residue that is non-conductive, non-corrosive, and serves as a protective coating that can be removed with solvent cleaners. Its activation properties are designed for gold-finished boards and lead-free metallization. AMTECH, www.amtechsolder.com. Booth 1824.
Complete Cleaning System
The Trident is capable of removing flux residues including rosin, no-clean, and water-soluble both leaded and lead-free, or mixed. Its automatic post-reflow defluxing process comprises prewash, wash, rinse, cleanliness testing, and drying. Trident’s automatic chemical injection system adds a programmable volume of defluxing chemical to the wash water. Prewash offers steam soak, high-pressure DI water spray, or chemical spray and soak. Rinse is controlled by the built-in cleanliness tester. The Trident includes a closed-loop wash solution recycling system. Defluxing and cleanliness testing occurs on up to 200 101- × 152-mm boards and up to 28 457- × 508-mm boards per hour. The user interface delivers instructions in seven languages. Machines can be fixed remotely on a real-time basis. Aqueous Technologies Corp., www.aqueoustech.com. Booth 2431.
Conformal Coating System
The SL-940E conformal coating system with integrated closed-loop process controls reportedly delivers high quality and productivity for automated coating processes. Its 750-mm/sec. coating speed and 1-g peak acceleration provide 30% faster throughput. A high-accuracy robot and proprietary jetting and coating technology improve edge definition. Traceability and datalogs for critical parameters, including fluid and air pressures, fan width (automatically adjusted for viscosity variations), fluid temperatures, and flow rates, are set and monitored through software-controlled electronic regulators. Integrated electronic controls and software plus a vision and pattern recognition system make programming easy. The work area accommodates multiple board arrays and large substrates up to 500 mm. Downdraft ventilation and spill containment provide an efficient path for VOC removal. Asymtek, www.asymtek.com. Booth 511.
Batch Cleaners
The expanded family of AquaTherm high-performance batch cleaners features a flexible cleaning system that offers performance and capability in a smaller, cost-effective, energy-efficient footprint. This flexibility combines with steam cleaning capability via an onboard steam generator. Various configurations are available to address different process chemistries and applications. Austin American Technologies, www.aat-corp.com. Booth 2249.
Automated Programmer
With four Flashstream programming sites, the 3000FS automated device programmer is designed to solve excessive programming times caused by in-system, JTAG, and in-circuit production programming methods. It is rated at 1,050 devices per hour, handling parts in tray, tube, or tape input/output. The four Flashstream sites use proprietary Vector Engine coprocessor technology to accelerate flash-memory waveforms during the programming cycle. Synchronous operations eliminate dead times. BPM Microsystems, www.bpmmicro.com. Booth 2245.
High-reliability Lead-free Solder
High electrical reliability has not always been achieved at the desired levels during higher-reflow-temperature lead-free processing. ALPHA OM-345 halide- and halogen-free, no-clean lead-free solder paste complies with extensive electrical reliability tests the Bono reliability test (European benchmark), JIS (including copper corrosion), IPC Class III for voiding and ROL0 IPC classifications, and HP-EM. Its broad processing window facilitates transition from tin/lead to lead-free, and it reportedly exhibits excellent print capability performance with ultra-fine feature repeatability (11 mil2) including with high-throughput applications. Cookson Electronics, www.cooksonelectronics.com. Booth 443.
SPC Software
Process Insight statistical process control (SPC) software is based on enterprise-level database and open computing standards. It offers comprehensive charting with enhanced charts, providing improved yield analysis, moving-average trending, and lot-code charting. It is a common interface for the company’s SE 300 Ultra and Flex Ultra HR for data analysis and correlation. Chart-specific alarms signal out-of-control data and trends. It can be integrated to shop-floor control software for full traceability. The SPC software also can preschedule reports. CyberOptics Corporation, www.cyberoptics.com. Booth 2215.
X-ray System
The XD7600NTHP digital X-ray inspection system uses a high-power tube with 10 W and submicron feature recognition. It retains submicron resolution at full power, allowing faster image acquisition in CT applications and lower noise with online X-ray images. Its high penetration capability benefits inspection of dense materials, such as multilayer PCBs with heatsinks. Dual monitors are optional. The company also will introduce a XD7500NT digital inspection system with ImageWizard software and a sealed X-ray tube. Dage Precision Industries, Inc., www.dage.com. Booth 1632.
Reflow Monitor
The Surveyor is designed to provide an easy and accurate way to monitor the thermal performance of reflow ovens. With special sensors, the Surveyor identifies out-of-tolerance conditions before they affect product quality. This system eliminates the need for test boards, while simplifying profiling process, according to the company. The sensors are fixed to circumvent variables associated with thermocouple attachment; an adjustable frame rides on the oven’s rail or mesh belt. Surveyor software automatically stores profiles for analysis. Datapaq, www.datapaq.com. Booth 1438.
Printing Software
Instinctive V9 software is designed to maximize machine usage, process control, and operator efficiency. Improvements to the printer software allow faster setup with more reliable first-time print, lower operator training time, and easier error avoidance and recovery, according to the company. It also features enhanced parameter editing, command availability, and real-time feedback for NPI, process monitoring, and reduced stoppages. The software is compatible with the company’s understencil cleaning, print verification, and related tools. DEK International, www.dek.com. Booth 1659.
Pick-and-Place Series
The SM series of chip shooters and placement systems feature a common operating interface across platforms, flying-vision centering with individual cameras per spindle, and head design targeting simultaneous component pickup from SM feeders. The SM411 chip shooter places at 42,000 CPH at ±50 µm, 3 sigma, placing 01005s through 14-mm2 components. With dual gantry, it boasts dual-lane, single-lane, or joined-mode configuration. The series also includes the SM421 flexible mounter with optional external side tray holder, and screen printers. Dynatech, www.dynatechsmt.com. Booth 859.
Thermal Profiler
The MEGAM.O.L.E.20 profiler features built-in intelligence, 20 channels, and one-button go/no-go profile validation. It is 7.2-mm thick. The included MEGAM.O.L.E. “M.A.P.” software is reportedly easy to use and flexible, with three workflow Wizards, multiple levels of data detail, Target-10 profile validation, and 180+ custom data measures. Detachable input/output Pods permit storage of machine, assembly, paste, and Target-10 parameters for a given PCB. Instant profile checking simplifies decisions without PC download; it also collects dozens of profiles prior to downloading. NANO-connectors suit restricted-space applications and increased thermal protection. ECD, www.ecd.com. Booth 2216.
Conformal Coating
NVOC is polyurethane-based and reacts with atmospheric moisture to produce a tough, flexible coating. It has similar processing parameters and drying times to solvent-based coatings, which enables an easier change to VOC-free PCB protection without changing processing parameters. NVMC, the NVOC machine cleaner, was designed alongside NVOC to eliminate the use of solvents when flushing through equipment, preventing any coating deposits left in the machine from curing. Electrolube, www.electrolube.com. Booth 870.
Hybrid Rework System
The HR 100 A high-end hybrid convection reflow and IR rework system meets IPC standards. It is hand-operated and combines medium-wavelength IR radiation with a gentle flow of hot air for soldering/de-soldering of densely packed SMT components. Hot air increases the speed and effectiveness of IR; IR allows for low air flow. This tool delivers homogenous heat to 0201s to 20- × 20-mm SMDs. Exchangeable hybrid adaptors focus 200 W onto the component, while protecting adjacent areas. It runs in a closed-loop program using a k-type sensor and component temperature controls. With optional heating plate, the set provides IR bottom-side heating (800 W), a Z-axis tool stand, and an X/Y PCB holder. Software provides multiple functions to set and store process parameters, document results, and other information. Programs are factory-preset or operator-created. ERSA North America, www.ersa.de. Booth 624.
Pick-and-Place Machine
Designed for prototyping and mid-size production runs, the PANTERA-XV placement system is said to offer high placement accuracy and speed, a broad application range, high reliability, and low maintenance costs. It handles 0201s through 50- × 50-mm QFPs and pitches down to 0.4 mm. It has 108 feeder slots and recognizes all intelligent tape and stick feeders automatically. The system places 0201s at up to 4,500 CPH. A magnetic linear measuring system is accurate to 1 µm; alignment is performed with on-the-fly laser and bottom-up vision systems. Another vision system automatically corrects PCB positions and allows component location teach-in. CAD data can be converted directly to assembly programs. Essemtec AG, www.essemtec.com. Booth 501.
Placement System
The iineo-II platform builds on the iineo’s high feeder count, increased board-size allowances, and increased maximum component height while incorporating turret heads, intelligent feeders, linear motors, and digital cameras. The flexible, dual-gantry system can be configured with 8- or 12-spindle rotary heads, one or two board-positioning mechanisms, oversized board options, and front-only or front and rear feeders. Placement occurs at 14,000 to 26,000 CPH at 35-µm accuracy for QFPs through 60-µm accuracy for chip components. It places 01005s through 4" connectors. Options range from glue dispensers to electrical test and supplemental nozzle holders. Europlacer Limited, www.europlacer.com. Booth 1624.
Printer Software
Enhanced printer software for new and existing machines is designed to allow novice through experienced users to create recipes and changeover old recipes. It offers step-by-step configuration, with advanced settings available at each step. The recipe is created with PCB dimensions, under-board support positioning, alignment, print, and stencil cleaning parameters. Cleaning method and frequency settings are stored with each recipe. Users can add an image of the target PCB to direct cameras. Fiducial teach finalization is completed automatically. Exerra, www.exerra-na.com. Booth 739.
Phase-change TIM
PowerstrateXtreme Dispensable (PSX-D) is a phase-change thermal interface material in a paste medium that shares performance characteristics with traditional phase-change films. The liquid PSX-D can be applied at various thicknesses determined by the application, via stencil, needle, screen, or manual printing. When heated, the material flows, conforming to heatsink and device surfaces and expelling air. This is said to reduce thermal impedance. It also is reworkable. Henkel Corporation, www.henkel.com/electronics. Booth 634.
Stencil Wiping Fabric
The AQUAVATOR stencil cleaning fabric suits use in automated stencil cleaning systems and under vacuum. It contains harmless cleaning agents embedded in a thick and coarse multioriented fibrous network. Water activates the cleaners, which clean and collect lead-bearing and lead-free solder pastes on stencils. AQUAVATOR eliminates ESD damage caused by static buildup from stencil wiping fabrics. High-Tech Conversions Inc., www.high-techconversions.com. Booth 2085.
Flexible Modular Mounter
GXH-3 flexible modular mounter places at 95,000 CPH. Proprietary “Direct Drive” flexible high-speed heads have a component range of 0201/01005 through 44 × 44 mm. The GXH-3 incorporates an independent CCD line sensor for each head, performing a component thickness measurement of each part and automatically adjusting for variance. Laser height verification measures programmed points on each board to detect warpage. Built-in PoP placement ability comes via the company’s fluxing module. Component feeding options include the ability to install 200 different taped 8-mm devices at one time, three tray feeding options, vibratory stick feeders, and quick bank-feeder change carts. Hitachi High Technologies America, www.hitachi-hta.com. Booth 1645.
Air-reflow No-clean Lead-free Solder Paste
Indium8.9 was formulated to produce consistent print volumes through apertures below the industry-recommended minimum area ratio of 0.66, printing accurately for CSPs and WLPs. Indium8.9 exhibits low voiding (<5%) over various profiles when soldering BGAs with via-in-pad technology. A robust processing window can minimize potential defects, as well as accommodate various board sizes and throughput requirements. Indium8.9 was designed for thermal stability and maintains a soft, pliable residue after reflow. This targets easier probe-testability and fewer false rejects during ICT. Indium Corporation, www.indium.com. Booth 747.
Chip Shooter
The FX-3 chip shooter is rated at 60,000 CPH and targets flexibility and ultra-high-speed placement in a compact footprint. It includes quick-change feeder banks and optimization software. The modular system can be used in multiples and with the company’s other products. It will be demonstrated with a KE2080 flexible mounter and another FX-3, creating a line with 135,400 CPH and placement capability for 01005s through 50- × 150-mm connectors. It uses LNC-60 high-resolution 360° component laser centering system. Juki Corporation, www.jas-smt.com. Booth 2025.
Lead-free Soldering
The Lead-Free Solutions portfolio includes products and services from bar solder to technical process advice. Highlighted at APEX will be the lower-cost, silver-free Ultrapure K100LD lead-free bar and wire solder alloy. K100LD is a Sn/Cu/Ni alloy with metallic dopants to control grain structure and copper dissolution rates. It promises anti-drossing reflow, bright solder joints, no visible shrinkage, and good thru-hole penetration with topside fillets. EM907 solder paste, also in the portfolio, targets high-yield lead-free manufacturing in high-thermal-demand assemblies. It boasts a long stencil life and quality printing at up to 6"/sec. Its hot and cold slump behavior is said to eliminate bridges and solder-ball formation. Kester, www.kester.com. Booth 1660.
Thermal Profiler
Featuring a compact design, the KIC Explorer thermal profiler fits 12 thermocouples in a miniature-TC harness design. It reportedly is ruggedized for harsh real-world usage conditions, incorporating SMT technology and high-temperature-rated components. Benefits include a high sampling rate, greater memory capacity, improved data precision, and USB data transfer to operators’ computers. The software uses a modern graphical interface and measures slope, peak temperature, TAL, and other profile and process data. A process window index (PWI) statistic identifies if profiles are in-spec. KIC, www.kicthermal.com. Booth 1977.
Aqueous Cleaner
AQUANOX A4625B is an MEA-free blend used in batch washers to remove pastes, tacky fluxes, rosin flux, no-clean flux, lead-free flux, and assembly residues. A4625B is diluted with water, preventing damage to delicate substrates. It is safe to use on yellow metals, aluminum, ferrous metals and composites, and most precious metals. It works with PVDF, Kalrez, Teflon, and ceramic elastomers and filters, polypropylene or stainless equipment. Bath life studies show high loading capacity for long tank life, low maintenance costs, and reduced waste generation and chemical consumption. The cleaner is a biodegradable aqueous solution with <25 g/L VOC. It contains no CFCs or HAPs and is nonflammable and noncorrosive. A mirror finish can be obtained on solder bumps when rinsed with DI or reverse-osmosis water. Kyzen Corporation, www.kyzen.com. Booth 2219.
Stick Magazine
The Agilis Stick Magazine (ASM) targets accuracy, speed, and flexibility. Unlike stick feeders that rapidly vibrate up-and-down to feed components, the ASM uses a high-precision, short-stroke linear drive with servo-controlled horizontal motion. The ASM handles a range of SMT components from TSSOPs to large PLCCs and high connectors for a range of jobs. Removable stick pallets with a built-in pallet ID and barcode system allow you to replenish and pre-load pallets, as well as prepare data before pallets are loaded into the magazine. Feeding is calculated automatically based on component data that’s entered prior to loading. Pick-up positions are localized and trimmed automatically as well. MYDATA Automation, www.mydata.com. Booth 211.
Process Improvement Tool
The Q-upNavi software suite offers predictive inspection at each stage in PCB production. It checks the success of each process, pulls up defects, and suggests possible diagnoses. The process improvement tool incorporates four software packages that optimize a manufacturers’ process by reducing the initial AOI program creation time; implementing standardized fine-tuning among several engineers to reduce false call errors; identifying the root cause of failures by inspecting at multiple points in the process and analyzing images to find the fault source; and minimizing training and travel costs using remote coaching and teaching of Omron AOI hardware over a secure link between factories. Omron Electronics LLC, www.omron247.com. Booth 2537.
MES Software for Lean
The Optel MES software suite with Dynamic Production Scheduling targets low-volume/high-mix manufacturing. The scheduling program is designed to eliminate unnecessary changeovers and reduce changeover times, and minimize WIP and inventory levels. It takes work orders as input from an ERP/MRP system, scans for common parts and due times, and groups work into common setups. These are scheduled to optimize SMT lines and placement machines. Manual scheduling and rescheduling allows for hot or prototype runs. Dynamic Production Scheduling works with kitting, automated multi-vendor machine programming, and optimization functions in the software. Optimal Electronics Corporation, www.optelco.com. Booth 2147.
Process Control
The Capacity Analysis System (CAS) provides quick and efficient estimates for future production line capacity without a full program development process. CAS also leverages the optimization and simulation engine of Panasonic’s PanaPRO software for accurate analysis results. The application uses CAD product data, when available, imported from PanaPRO’s IPO software module. Alternatively, the user interface can be used to characterize products based on information already known such as number of parts, relative part types, etc. CAS then generates an estimate of the throughput and resources required to build the product on a given line. The system can help accelerate and improve accuracy for EMS quotes to customers. Panasonic Factory Solutions Company of America (PFSA), www.panasonicfa.com. Booth 2225.
Parylene Coating
In 2008, Para Tech marks 40 years of commercial application of parylene conformal coatings. Its offering includes coating ferrite cores, military components, outer space and aerospace parts and assemblies, disposable and implantable medical devices, sensors, and key pads. The company will highlight equipment designs that reduce materials consumption and process time while enhancing uniformity. They also plan to promote in-house and at-customer parylene coating services. Para Tech Coating Inc. (PTC), www.parylene.com. Booth 2177.
AXI System
With hardware and software targeting highest magnification and maximum defect coverage, the microme|x CT with x|act combines AXI, 2D X-ray inspection, and 3D CT. It features a proprietary software platform and intuitive inspection program requiring minimal setup. Using a scanner, the component’s CAD data is read and laid over the image in LIVE CAD-OVERLAY, which has sample data available at all times, even when rotating or tilting the sample or during ovhm. The tool offers pad-based off-line programming; optimized inspection strategies for different pad types; automated inspection-view generation; and program portability. x|act automatically finds, measures, and compensates for distortions and height differences. phoenix|x-ray Systems+Services, www.phoenix-xray.com. Booth 2646.
Rework and Soldering System
The Gem performs wave and selective soldering and thru-hole rework. It is cost-effective with a reportedly robust mechanical design and intuitive standard-single-button selector program. Targeting low-volume, NPI, and rework applications, the Gem features a 20 × 20" moving board carriage with X/Y maneuvering controlled via joystick. The carriage can be tilted for wave soldering with a dedicated nozzle. Selective soldering uses single-point AP-1 nozzles; 14 nozzles range from 2.5- to 12-mm diameters and are quickly interchanged. Other features include a hot nitrogen curtain, laser guidance alignment system, quick-change solder bath and pump for lead-free transitions, and automated purging flux bottle systems. A top board overlay system allows operators to view solder and flux points without obstruction. The operators can simultaneously solder components on the active board. Pillarhouse Ltd., www.pillarhouseltd.com. Booth 1425.
ESD Workbench
The Model HD is available from 48 to 96" long and 30 or 36" wide, at a standard 30" height. Incorporating a heavy-duty, independent four-leg design, the Model HD provides 1000-lb. capacity. It is available with an ESD laminate top targeting manufacture of sensitive electronic items. The ESD laminate also protects computers and electronic equipment. ESD ground kits available in standard; standard with banana plug jacks; standard wrist strap 6-ft. cord; and flush mount with jacks. “T” mold protection around the perimeter of the laminate tops protects workers. Model HD can be configured to accept side uprights for accessories. Pro-Line, www.1proline.com. Booth 706.
Lead-free Solder
A lead-free alternative to SAC and lead-bearing alloys, SN100e is a Sn/Cu/Co alloy that reportedly lowers costs of lead-free soldering by omitting silver and by reducing dross. It is RoHS-compliant and exceeds J-STD-006. Solder joints are said to be shinier and less grainy that with other alloys, and wetting is good. The solder is available as bar, wire, paste, spheres, powder, and alloy. Lower viscosity improves fluidity. In wave soldering, less solder is consumed than with comparable alloys, according to the company. Qualitek International Inc., www.qualitek.com. Booth 469.
XRF Elemental Analyzer
The LeadTracer-RoHS X-ray fluorescence (XRF) system features a solder analysis and identification upgrade that allows users to identify solder alloys or analyze the composition of alloy in a solder pot. It can be used in rework-and-repair operations, for maintaining in-spec processing with critical or dual-alloy assembly operations, traceability on non-continuous runs, component identification, and other weak points in processing. The LeadTracer-RoHS XRF analyzes the entire component in a short time frame to identify elements and quantities. RMD Instruments LLC, www.rmd-leadtracer.com. Booth 1563.
Convection Reflow System
PowerReflow boasts a slender conveyor system, single-blower technology, and improved central flux management. The LowMassConveyor transport system has chain guide profiles, which are carried by steel cables tensioned throughout the entire machine. This concept prevents chain guide profiles from affecting the temperature profile. Chain guide profiles are kept parallel for high reliability. Only one spindle mechanism is required within the process zone, avoiding corrosion on surfaces. Each heating zone is equipped with single-blower-technology with tangential fans for homogeneous heat distribution. All heated zones are connected to the system directly for process-gas cleaning. Removed process gas is conducted within the hot area up to the cleaning point, so condensation is controlled. The cleaning system is the first cold point that the process gas meets a thermally conditionable condensing cyclone. SEHO, www.seho.de. Booth 1677.
Placement Machine
The SIPLACE X4i’s 100,000 to 120,000 CPH placement speed, with board sizes up to 250 × 380 mm in dual-lane, and 436 × 380 mm in SIPLACE flexible dual-lane mode, is based on non-proprietary IPC 9850 standards. It operates with a dual conveyor and four 20-nozzle high-performance heads. Its i-Placement mode shortens gantry travel between feeders and PCB. Boards are transported into the placement area in dual-lane mode on two parallel conveyors, allowing both PCBs to be populated with two placement gantries one placing while the other is picking. Conveyors are located close to feeders for higher placement density and speeds. Productivity and flexibility gains are possible with “Productivity Lane,” which enables the X4i to be run in parallel mode. This allows the placement machine to be configured in serial mode then operate in parallel mode. If a machine stops, boards pass through to the next downstream machine and production continues. Siemens, www.siemens.com. Booth 2359.
Stencil Cleaner
EnviroGuard stencil cleaner is able to clean all types of solder paste with a 100% closed-loop process. It matches properties of the company’s 440-R SMT Detergent to a specifically designed filtration/UV system that facilitates 100% closed-looping of both wash and rinse solutions. Filters are changed twice annually. Liquid hazardous waste never exits the system; 99% of the waste solder paste from stencils and misprinted PCBs is captured for recycling. The remaining 1% is removed by the EnviroGuard filtration system. Users can return spent filters to the company for regeneration and reuse. All water is reused rather than released. Smart Sonic, www.smartsonic.com. Booth 1664.
Pick-and-Place Equipment
The SI-G200 pick-and-place equipment combines speed and accuracy in a compact size. It offers two optional interchangeable rotary heads in one body. It is engineered to improve placement capacity by using the existing machine platform without increasing production floor space. Interchangeable dual heads are programmed to shorten pick-up and placement lead times, and to accept a range of board sizes with 0402/01005 compatibility. The dual high-speed head model can generate 45,000-CPH performance and 45 µm at 3 sigma placement precision. The SI-G200 is calibrated for minimal maintenance; tested to last up to 3× longer than previous models. The SI-G200 high-speed model produces at near 20,000 CPH/m2 while maintaining low electric power consumption. Sony Manufacturing Systems America, Inc., www.sonysms.com. Booth 225.
ICT Tester
The 3030 board tester is flexible for different test requirements. It is reported to be an easy-to-use and affordable in-circuit tester, offering multi-functionality with high throughput. Versatility is due to the variety of tester models and to the open and modular system architecture. Nearly any type of test fixture receiver can be adapted to the 3030 Series testers. Testers are chosen, modified, and expanded to meet requirements. A 3030 in-line model in a Multi-Stage configuration is designed to be integrated in the production line, with automated board handling. It can perform parallel test of several boards by simultaneously executing required operations, such as ICT, on-board programming, functional test, or optical inspection. SPEA, www.spea.com. Booth 611.
Printing System
The next-generation MPM Momentum printer incorporates sophisticated motion control and I/O for improved communication and rapid movement with minimal wires and cables. Its vision system includes a high-speed digital camera, proprietary look up/look down capability, telecentric lens, and advanced lighting for alignment and inspection. Contrast-based 2D BridgeVision and StencilVision with SpeedVision are available. Features include proprietary transport and squeegee systems, vacuum stencil wiper, and roller solvent bar delivery system. Operation is via Benchmark, a Windows-based system, featuring a GUI common to all new MPM printers. A single, front-fixed-rail conveyor; top clamp and centernest holddown; programmable squeegee; vacuum stencil wiper; and 17" display are standard. Speedline Technologies, www.speedlinetech.com. Booth 2445.
Add-on Prototype Tool
A factory-certified add-on enforces Sunstone’s manufacturing capabilities interactively inside CadSoft’s EAGLE PCB layout tool. The DfM add-on allows layout users to design PCBs within Sunstone’s manufacturing capabilities, using a design rule checking (DRC) engine built in to EAGLE and supplying a full complement of Sunstone-specific rules for the engine. The tool targets reduced design errors early in the design process. The existing rule deck avoids manual rules creation. As a part of the Sunstone ECOsystem, DFM Add-Ons help the design flow of design and assembly services, suiting quickturn prototypes, fewer turns, and greater access to PCB manufacturing services. Sunstone Circuits, www.sunstone.com; CadSoft Computer, www.cadsoftusa.com. Booth 2017.
RoHS Tester
NITON XL3 700 Series X-ray fluorescence (XRF) analyzer provides nearly real-time solder alloy grade identification and laboratory-quality composition analysis of plastics and polymers, performing solder screening in 5 sec. The XL3t features a 50-kV, 2-W X-ray tube. The series targets quick screening to rapid simultaneous measurement of up to 25 elements in a sample. Benefits include high speed and low element detection limits, optional small spot analysis, and internal color CCD camera with image storage for recordkeeping and documentation. The tools also screen high-reliability solder joints and components for lead contents. It performs computation, data storage, communication, and other functions. The NITON XL3 series comes with the NITON Data Transfer software, a suite of data management utilities for certificates and reports, monitoring, and remote operation. Thermo Fisher Scientific, Thermo Scientific NITON Analyzers, www.thermo.com/niton. Booth 2210.
Process Control Software
Dimensions Line Manager is a shop-floor control software product designed to increase line utilization, improve product quality, provide component traceability, track material locations and consumption, and maintain feeders. Software technology uses Microsoft’s .Net 2.0 framework, supporting all programs. It boasts an intuitive touch-screen interface with streamlined, wizard-style functionality, dynamic product screens, and a cost-effective architecture with independent modules. Universal Instruments, www.uic.com. Booth 1471.
High-throughput AOI
The S3088-II high-speed AOI system includes Viscom 8M sensor technology and EasyPro3D user interface. The system suits post-reflow, print, and placement inspection, handling PCBs up to 450 × 350 mm. A reworked system design makes performance stable at top speeds. It boasts 11.7 or 23.4 µm/pixel at the same image size to be chosen for each analysis, allowing inspection of 01005s. Color evaluation is standard. EasyPro3D software includes Automatic Parameter Optimization (APO), LIB2007 inspection library, ValidCompare mode, and TrustedChange integrated verification. Add-on modules include a repair and post-classification station, off-line programming, and VPC statistical process control. Viscom, www.viscom.com. Booth 1445.
Wave Soldering System
Delta 3 wave soldering systems are simplified machines based on the Delta platform with EasyUse real-time interface for programming, setup, and process changes. The system boasts a proprietary solder pot design and dross-management system. It targets low cost of ownership (COO). Closed-loop thermal controls maintain solder and preheat temperatures; preheat is three-zone configurable. Computers constantly monitor wave height, flux volume, and board temperature, reportedly enabling repeatable processing and high first-pass yields. Options range from wire support to crash detection. The system is lead-free capable. Vitronics Soltec, www.vitronics-soltec.com. Booth 1825.
Summit Versa
The new Summit Versa rework platform is designed to perform specific tasks for rework and production, customized by the user. It can be configured with single or multiple application-specific capabilities, optimized for component removal, site preparation, or assembly and reflow. Systems can be grouped together, each with a targeted function, for high-volume rework. Various tooling and vision options exist, and systems are field-upgradeable. Standard and high-resolution models are available. VJ Electronix, www.vjelectronix.com. Booth 648.
AXI System
The X3 AXI system for populated PCBs offers assemblers advanced, fast, and complete 3D inspection of BGAs and other hidden solder joints. The X3’s proprietary imaging technology rapidly gathers multiple oblique images of the sample to construct a 3D rendering, for identifying defects on single- and double-sided PCBs. The X3 selectively uses 2D or 3D technology on target areas. Programming reportedly is fast and intuitive; standard package libraries simplify training and enable program portability across lines. The X3 suits in- or off-line applications and offers precise solder joint inspection, fast throughput, and low false calls. Remote programming increases system utilization and real-time SPC software enhances yields. YESTech, www.yestechinc.com. Booth 559.