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APEX Product Showcase
December 31, 1969 |Estimated reading time: 14 minutes
Following are some of the many hot, new products that can be seen this month at the IPC, Printed Circuits Expo, APEX, and the Designers Summit in Los Angeles, Calif. For more information on these products, please visit each company at the show.
Automation Line
JOT - an automation line featuring a bare-board unstacker, segmented conveyor, and high-speed router is compatible with lead-free production. The J210-50 bare-board unstacker feeds boards onto a line with a 500-mm pass-through length, adjustable track height, and support mechanism. The J204-50 segmented conveyor transports and buffers PCBs with multiple-drive, adjustable technology. The J215-33 single-magazine handler suits HMLV production. The J501-44 high-speed router uses grippers to hold PCBs in place for underside milling. The J501-41 stand-alone mini-router performs topside routing with cutting speed of up to 60 mm/s. Elektrobit Group plc, Oulunsalo, Finland, www.elektrobit.com. Visit Elektrobit at Booth 1847.
Device ProgrammerThe desktop, automated Helix programming system is equipped with two tray input and output handling systems with a reject location. It uses the core programming technology and socket modules of standard BPM lines, with interchangeable pressure plates. The system uses two seventh-generation programming sites with FX4 socket-module capability. Integrated motors open and close programming sites in synch with part placement and retrieval. Throughput is 800 dph. BPM Microsystems, Houston, Texas, www.bpmmicro.com. Visit BPM at Booth 2223.
Material Handling Systems
INOCART, INOKIT software, and the INOSOURCE procurement program enable kitting and reloading of SMT lines with integrated inventory management. INOCART is a configurable material-handling solution that stores disparate package types, including odd forms. It can hold feeders so that kits are presented to SMT equipment for immediate use. INOKIT software complements the carting system with “1 package, 1 location” technology that tracks materials. Inovaxe Corporation, Sarasota, Fla., www.inovaxe.com. Visit Inovaxe at Booth 1672.
Wire Bonders
HB16 and HB05 wire bonders perform wedge and ball bonding in one system. The machines target small production, prototyping, and R&D environments. The HB16 semiautomatic bonder incorporates motorized Y/Z travel to control loop shape with high repeatability. The system features manual, step, and semi-automatic bonding modes, as well as stitch and bump bonding. The bonder features bump bonding for 17- to 50-μm wire and 25- × 200-μm ribbon. FINETECH, Tempe, Ariz., www.finetechusa.com. Visit FINETECH at Booth 2715.
Filtration Systems
CHEMAG thermoplastic filtration systems are available in pleated, conventional cartridge, or horizontal disc designs. CHEMTREX pleated-filter technology meets process requirements, including critical multi-layer board production, with absolute-Beta ratings down to 0.45 μm. Warco/Warrender, Lake Forest, Ill., www.warrender.com. Visit Warco/Warrender at Booth 906.
Batch Cleaner
AQUANOX A4625B is a MEA-free aqueous blend designed for optimum effectiveness in batch washers. The cleaning material removes flux residues and contaminants, and is environmentally friendly. Low concentrations for use reportedly increase efficiency and prevent substrate damage. Kyzen Corporation, Nashville, Tenn., www.kyzen.com. Visit Kyzen at Booth 1401.
Ultrasonic Stencil Cleaner
With a choice of no-rinse or fresh-water-rinse chemistries, the Multi-tech Ultrasonic Stencil Cleaner cleans SMT stencils, misprinted PCBs, pallets, oven radiators, and related tools. The plumbing and programming network allows closed-loop operation. Smart Sonic Corporation, Canoga Park, Calif., www.smartsonic.com. Visit Smart Sonic Corporation at Booth 2659.
Cleaning Spray and Wipe
Universal remover ARW500 and ARW300 Aerowipes clean and degrease electronic assemblies and workspaces, tools, and uncured and semi-cured adhesives and sealants. The products are water-based and non-hazardous, and evaporate without residues. The large wipes are impregnated, non-woven, and lint-free. Electrolube, a division of HK Wentworth Ltd., Swadlincote, Derbyshire, U.K., www.electrolube.com. Visit Electrolube at Booth 2707.
Solder Surfactant
A solder-process enhancement product, MS2 molten-solder surfactant reportedly enhances the quality of a solder joint to reduce process-related defects, eliminates dross, and reduces the volume of hazardous waste produced in the assembly process. P. Kay Metal, Inc., Los Angeles, Calif., www.pkaymetal.com. Visit P. Kay Metal at Booth 1065.
Dispensing Robot
The model I&J7900-LF, a RoHS-compliant, compact, three-axis dispensing robot, incorporates a work area of 8" × 8". Operators program the robot using dispensing software and point-and-click instructions. Up to 100 programs can be stored in the robot’s memory or flashcard. An optional software package offers increased storage, editing, and CAD-file conversion. I&J Fisnar, Inc., Fair Lawn, N.J., www.ijfisnar.com. Visit I&J Fisnar at Booth 2561.
Dummy Components
Dummy components for Amkor Technology’s package-on-package (PoP) stacked daisy chain, a PC200 PoP test board and kit, and other packages and test boards are available. Mechanical samples for components from several SMD manufacturers, solder training kits, and PCB training and test boards offer various testing options. Practical Components Inc., Los Alamitos, Calif., www.practicalcomponents.com. Visit Practical Components at Booth 2565.
Pick-and-Place Platform
A quad-gantry machine, the Genesis GC-120Q platform uses four Lightning heads for a maximum throughput of 120,000 cph. The machine places 30-mm2 to 01005 components for high-speed or high-mix assembly. Universal Instruments, Conklin, N.Y., www.uic.com. Visit Universal Instruments at Booth 2301.
Selective Coating System
The Prism selective coating system features enhanced software, offline programming, and increased speed and throughput. The system allows for 90° pneumatic coating-head rotatation. Ultrasonic Systems, Inc., Haverhill, Mass., www.ultraspray.com. Visit Ultrasonic Systems at Booth 1761.
AOI System
The Flex Ultra AOI platform consists of the Flex Ultra AOI and Flex Ultra HR systems. The AOI system boasts inspection capability for 0201 components and larger. The HR addition inspects 01005 components, and uses a 5.0-megapixel camera to improve optical capabilities. A new operator user interface (OUI) for the Flex Ultra graphical platform is more intuitive than previous generations, with multiple languages and a translation option. CyberOptics Corporation, Minneapolis, Minn., www.cyberoptics.com. Visit CyberOptics at Booth 2561.
AOI and Defect Prevention
The Medalist SP50 Series 3 SPI system reportedly provides speed, accuracy, and repeatability for form factors down to 01005. Proprietary imaging techniques and inspection algorithms offer SPC and charting on paste, pre- and post-reflow trends, defect analysis, and defect prevention. A separate ICT offers ease-of-use for in-production tests. Simple GUIs are designed for clarity during high-volume manufacturing. Agilent Technologies, Santa Clara, Calif., www.agilent.com. Visit Agilent at Booth 2213.
AXI Capability
Automated X-ray inspection (AXI) capability, introduced on the COUGAR PRO system, identifies process errors based on product inspection and error trends. The COUGAR PRO is modular and can be configured as a stand-alone system with automatic analysis, as an off-line automatic handling and analysis system, or in line. A five-axis manipulator controls samples under inspection. COMET, Garbsen, Germany, www.comet.ch. Visit COMET at Booth 2611.
Process Control Platform
The ScanINSPECT VPI inspects stencils, screens, boards, and components - correcting mismatches pre-production. The process-control tool qualifies each step of assembly and fabrication. The stand-alone system uses a high-resolution, color flatbed scanner with a NIST-certified glass calibration plate. ScanCAD International, Littleton, Colo., www.ScanCAD.com. Visit ScanCAD at Booth 2043.
XXX Option
A computerized tomography (CT) option, XXX, will be available for all YTX-3000 systems, and the 3-D imaging capability will become part of high-resolution models. The capability generates a 3-D image of an object from a series of 2-D images captured on a single axis of rotation. Suited to stacked die, MEMS, package-in-package (PiP), and PoP, the CT option installs without modifications. YESTech, San Clemente, Calif., www.yestechinc.com. Visit YESTech at Booth 1407.
XRF System
The LeadTracer-RoHS XRF system reportedly provides fast, accurate, and portable screening capabilities to meet RoHS requirements. It analyzes a component by tracking the entire energy spectrum. Ergonomic design, laser-guided sample indicator, bar-code reader, spectrum display, Bluetooth connectivity, and adjustable apertures facilitate ease-of-use. RMD Instruments LLC, Watertown, Mass., www.rmd-lpa1.com. Visit RMD Instruments at Booth 1052.
Immersion Silver Final Finish
AlphaSTAR microvoid-resistant immersion silver final finishing reportedly meets PWB lead-free assembly requirements with high first-pass yields and improved solderability. The process selectively deposits a silver coating that meets or exceeds fabricator, assembler, and OEM requirements to create a consistent and clean coating with low co-deposited organics, contact resistance, and tarnish. Enthone Inc., Cookson Electronics, Providence, R.I., www.cooksonelectronics.com. Visit Cookson Electronics at Booth 2419.
XRF Screening ToolLeadHound II features a RoHS/WEEE pass/fail mode to test plastics and metals. Using XRF technology, the tool detects restricted elements in a working environment, providing the parts-per-million or percentage of each element found. The tool uses IEC screening guidelines or user-defined parameters to determine RoHS, military, and avionics specifications compliance. HEPCO, Inc., Sunnyvale, Calif., www.hepcoblue.com. Visit HEPCO at Booth 2329.
Dispensing System
The Camalot FX-D dispensing system features a plug-and-play design to facilitate machine re-configuration. The model performs as a stand-alone or in-line system, and can be heated or unheated; it targets flexible manufacturing environments. Speedline Technologies, Franklin, Mass., www.speedlinetech.com. Visit Speedline at Booth 1853.
Hot-gas Rework SystemThe ONYX29 robotic hot-gas system is designed for lead-free rework applications. Eight automated axes and four zones eliminate operator manipulation. A 19", 5600-W bottom heating/cooling system preheats high-thermal-mass boards to 150°C. Other features include 75-mm alignment capability, fully automated force-controlled component shuttle, automated non-contact site cleaning, and on-the-fly thermal profiling. Air-Vac Engineering, Seymour, Conn., www.air-vac-eng.com. Visit Air-Vac Engineering at Booth 1721.
Chip Shooter
The sixth-generation KE-2070 is a high-speed, modular chip shooter built on a SuperCast single-casting base. It uses a LNC-60 high-resolution laser-centering system with magnascale resolution down to 1 μm, and facilitates placement of 33.5 mm2 to 01005s. Designed with six nozzles to reduce change-over times, the head reaches 16,000 cph; automatic nozzle detection verifies proper usage. The machine incorporates stepper motors in the conveyor system and fiber optic motion-control communications. Juki Automation, Morrisville, N.C, www.jas-smt.com. Visit Juki Automation at Booth 2437.
Pick-and-Place Machine
The MX high-speed placement machine features cascading modularity with placement rates up to 80,000 cph, 216 feeder slots per segment, and full-range component capability. The MX uses double placement areas in each module, with a multilevel transport system. MIMOT, Irvine, Calif., www.mimot.com. Visit MIMOT at Booth 1159.
Flying Probe Tester
Based on the core hardware and software of the VIVA integrated platform (VIP), AERIAL uses four independent, mobile test probes for both sides of a board. It suits prototypes, samples, and small- to medium-sized series. The machine has a vertical, compact structure for ease when loading and testing larger boards; a clamping system eliminates vibration. AERIAL uses a one-touch-per-net (OTPN) technique that injects multi-tone signals through the nets of the unit-under-test (UUT). Seica, S.p.A., Strambino, Italy, www.seica.com.Visit Seica at Booth 2101.
Pick-and-Place System
The SM321, member of the SM series of component-placement platforms, includes 24" × 20" large-board capability, and places components from 55 mm2 to 0201 form factors. The machine offers 21,000-cph throughput and increased PCB-transfer speeds. It supports SM-series slim-format feeders and optional SM-series Intelligent Feeders. Dynatech Technology, Inc./Samsung TechWin, Ltd., Horsham, Pa., www.dynatechsmt.com. Visit Samsung at Booth 1801.
Rework Station
Summit 2200 advanced rework station uses many Summit 1800 components and processes adjusted to lead-free. It features automated site prep with component removal, non-contact prep, and component placement with minimal intervention. Site-prep integration into the pick-and-place process is said to reduce thermal cycling and increase cycle speeds and yield. Automatic and vision-assisted placement eases high-lead-count component placement. A 4.0- or 5.6-kW bottom heater and motorized table accommodates maximum TAL constraints. VJ Electronix, Littleton, Mass., www.vjelectronix.com. Visit VJ Electronix at Booth 2637.
Batch Stencil PrinterThe SemiTouch Auto Vision (STAV) alignment batch stencil printer, a semi-automatic stencil/screen printer, targets SMT applications. With a print area of 16" × 20", stencil frame size up to 29" × 29", and board sizes from 2" × 2" to 16" × 23", the printer incorporates bottom-side tooling support. It uses servo-controlled, programmable X/Y/Theta automatic vision alignment. Other features include universal vibration squeegee heads and run-time diagnostics. Milara Inc., Medway, Mass., www.milarasmt.com. Visit Milara at Booth 1971.
Screen Printer
The eP30 series screen printers combine a mono-block casting and a two-stage, servo-driven granite table with a digital, servo-controlled drive system. The printers incorporate 2D&D print-quality inspection, stencil inspection, a triple-section PCB transport system, and programmable squeegee-pressure control. Exerra, Inc., Rosh HaAyin, Israel, www.exerra.net. Visit Exerra at Booth 1978.
Automatic In-line Stencil Printer
SP200avi, designed for medium- and high-throughput, high-mix applications, features a 23" in-line stencil area. An automatic rail-width adjust aids changeovers for high-mix manufacturing. Stencil loading is automatic, without stencil-frame adaptors for different sizes. A “look down, look down” vision alignment system uses twin roving cameras mounted on independent X/Y gantries to perform alignment based on fiducial marks or PCB/stencil features. Speedprint Technology Ltd., Poole, Dorset, U.K., www.speedprint-tech.com. Visit Speedprint at Booth 1123.
Squeegee Holder
The Magna-Print system consists of a proprietary universal-fit squeegee holder, adjustable paste deflectors, and blades to accommodate all PCB sizes. The quick-change blade holder is equipped with an arrangement of magnets and other features to secure blades. No-stick coating and lack-of-clamp hardware ease cleaning and reduce the possibility of contamination in lead-free assembly. Ovation Products, Bethlehem, Pa., www.grid-lok.com. Visit Ovation Products at Booth 1765.
Stencil PrinterThe model SP003-ML-V semiautomatic stencil printer comprises vision systems, a motorized print head, and vertical stencil separation. The printer accommodates stencils or screens up to 23" × 23", with a maximum print size of 400 × 410 mm. The machine controls squeegee pressure, angle, print speed, position, and post-print separation parameters. Different print mounts include vacuum, groove, flat, or magnetic tables for use with single- or double-sided boards. It suits small- to medium-volume production. ESSEMTEC, Aesch, Switzerland, www.essemtec.com. Visit ESSEMTEC at Booth 2259.
Stencil Cleaner
Cyclone precision-cleaning technology suits advanced stencils with rapid cassette-based paper changeover. The system provides bi-directional active cleaning. The technology’s five-stage cleaning head is progressive, combining a single wet oscillating stroke with five leading edges to dislodge and remove remaining residue from stencil apertures. This process is followed by a high-flow vacuum stroke using four vacuum vents. DEK, Flemington, N.J., www.dek.com. Visit DEK at Booth 2047.
Underfill
Loctite 3536 underfill is said to improve reliability in advanced CSP and BGA packages, quickly filling the space beneath these packages and the board. The material cures rapidly at low temperatures to minimize thermal stress to other components. When fully cured, it protects solder joints against mechanical stress, especially with lead-free solders. The electronics group of Henkel, Irvine, Calif., www.henkel.com. Visit Henkel at Booth 2001.
Conformal Coating
UV40 UV-curable conformal coating suits automotive and consumer electronics applications. The product maintains a fast UV cure and environment-friendly chemistry with proper adhesion to common solder resists. It uses a moisture-activated secondary cure mechanism and remains flexible in a range of temperatures without brittleness. HumiSeal, Taunton, Mass., www.humiseal.com. Visit HumiSeal at Booth 2205.
Lead-free Wave Solder Machine
The Nu/Era CV 16" lead-free wave soldering machine features on-board PLC control of process parameters, an internal reciprocating spray fluxer, and a preheater with two 600-W heating sections. The preheating section is over 42" long with a topside tunnel. There are two upper cooling zones, and one lower zone. The process width is adjustable from 2" to 16", conveyor speed and angle also are adjustable. The Nu/Flow CV line is available with 5, 6, 7, 8, or 10 heating zones with top and bottom heaters, and a temperature profiler. Technical Devices Company, a subsidiary of Winther Technologies, Inc., Torrance, Calif., www.technicaldev.com. Visit Technical Devices at Booth 2359.
Profiling SystemAn automatic profiling system, KIC Vision is designed to eliminate manual tasks associated with periodic reflow-oven profiling. It runs continuously and automatically in the background, generating profiles as often as once per hour. Embedded sensors in the oven and software measure product profiles against a baseline, creating process data for peak temperature, soak, and fit-to-process-window. KIC, San Diego, Calif., www.kicthermal.com. Visit KIC at Booth 1528.
Wave Solder System
Designed for lead-free, the Electrovert VectraES wave solder system features system-wide accessibility and targets low- to medium-volume production. It reportedly offers reduced flux usage and dross generation. Speedline Technologies, Franklin, Mass., www.speedlinetech.com. Visit Speedline at Booth 1853.
Lead-free Bar SolderUltrapure K100LD lead-free bar solder alloys feature low copper dissolution and no silver. The alloy primarily contains tin and copper with metallic dopants to control the grain structure and copper-dissolution rate. Features include anti-drossing technology and smooth solder joints, topside fillet with no bridging, and reduced leaching of solder pot materials. Kester, Des Plaines, Ill., www.kester.com. Visit Kester at Booth 1542.
No-clean Solder Wire
With a fluxing system designed for lead-free alloys, NC600 no-clean lead-free solder wire will not spatter in normal usage. Fluxing activity levels are said to promote fast wetting and improved spread. Diameter ranges of 0.010-0.125" are available. Qualitek International, Inc., Addison, Ill., www.qualitek.com. Visit Qualitek International at Booth 2137.
Ionic TesterThe C3 - Critical Cleanliness Control - ionic cleanliness tester examines contamination in a localized area of a PCBA, allowing for examination of specific areas that are sensitive and prone to performance issues. The method can determine location and levels of contaminants, and collects and stores extracted samples. When further analysis is needed, users can send samples for lab testing. Aqueous Technologies, Rancho Cucamonga, Calif., www.aqueoustech.com.Visit Aqueous Technologies at Booth 1109.
Solder Paste
Indium3.2 lead-free water-soluble solder paste reportedly increases finished-goods reliability. Its chemistry makes flux residues more clean-able after high-temperature reflow. The product also features high humidity resistance. Indium Corporation, Clinton, N.Y., www.indium.com. Visit Indium Corporation at Booth 1727.
Test Boxes
Mobile terminal test boxes J409-41 and J409-54 offer flexibility for RF-shielded test. J409-41 provides RF shielding with features such as one-hand open/close operation, quick adapter change, and reportedly minimal maintenance. The robotic cell provides an R&D, manufacturing, and service-test platform. J409-54 is an RF-shielded mobile terminal test handler designed for board-level and final testing of mobile terminals. It features semi-automatic operation, vision test system, and button test actuators. A panel flash stand-alone fixture offers open-nest fixture tests for board flashing and houses several nests in the same fixture. The device-under-test (DUT) loads manually into the nest. Connections are manually operated and designed for board flash and test. Elektrobit Group plc, Oulunsalo, Finland, www.elektrobit.com. Visit Elektrobit at Booth 1847.