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2001 Product Review
December 31, 1969 |Estimated reading time: 28 minutes
Equipment
Microfocus X-rayThe pcba|inspector is a 100 kV high-resolution microfocus X-ray system designed for PCBA inspection. Reportedly providing high image quality, the X-ray can detect details as low as 4 μm. Capable of handling boards up to 18 x 24", the system is said to create real-time images from all angles with an optional large capacity tilt axis up to ±45°. Features include a high contrast 6" dual field image intensifier with high sensitivity CCD camera. phoenix|x-ray Systems + Services, Camarillo, Calif.
Components
Video Port ProtectionPAC VGA200 and PAC VGA201 have been added to the company's family of PC and workstation video port protection devices. These products reportedly protect all seven signal pins of the VGA connector with ESD protection to IEC-61000-4-2 Level-4 (8 kV discharge). With the addition of these two devices, the VGA family is said to offer high-speed, non-inverting drivers for the two sync channels, as well as DDC support. This is said to facilitate interfacing of new generation, low-voltage controller ICs to the video connector in multiple-supply voltage environments. California Micro Devices Corp., Milpitas, Calif.
Services
Service Programs for Specialized OvensAn Advantage Service Assurance Program is offered for this company's high-performance industrial ovens, as well as other heat-processing equipment and environmental chambers. The program reportedly detects issues and repairs them before shutting down production. As a result, customers can expect that their equipment is operating at peak performance with quicker ramp times, uniform material heating and faster processing cycles. All services are said to be provided by personnel trained in the complexities of specialized ovens. Scheduling is flexible and convenient, with customers receiving priority in scheduling of visits and special discounts on parts. Despatch Industries, Minneapolis, Minn.
Software
PC-based Field SolverSI600A is a controlled impedance field solver for PCB designers and manufacturers. Said to be a powerful PC-based design tool, the system simulates variation effects in board parameters in more than 35 different single-ended, differential and coplanar PCB structures. The field solver features graphics presented in an Excel interface. Additionally, board parameters can be keyed in or imported directly from another spreadsheet. Results are viewed on screen, printed or exported for reporting purposes. Polar Instruments Ltd., Garenne Park, Guernsey, United Kingdom.
Materials
Dielectric MaterialsMICROLAM 200, part of a new MICROLAM family of dielectric materials, can be found in demanding applications in such industries as telecommunications, computing, test and measurement, defense, and aerospace. These materials are built on expanded polytetrafluoroethylene structures that are impregnated with various filled resins to meet different application requirements. The product is engineered with a low loss tangent (0.0036 through 10 GHz), reportedly making it an ideal material for high frequency, laser HDI PCBs or RF module applications. W. L. Gore & Associates, Newark, Del.
EQUIPMENT
In-line PrinterX5 is the latest addition to the company's German Engineered Performance product line. The printer reportedly offers a reduced footprint, but provides the flexibility of a large board size capacity. Features are said to include vision alignment with software-controlled variable lighting technology, two 1/2D post-print inspection with the capacity of stencil inspection and bridge detection, venturi vacuum wiper, user-friendly operator interface, and more. EKRA America Inc., Marlboro, Mass.
SMT Dispensing SystemThe Millennium M-2010 dispensing system reportedly delivers high-speed and accurate dispensing for surface mount applications, ideal for high-volume, production-critical dispensing. The system comes standard with the company's Fluidmove for Windows NT (FmNT) software. Pipelined fiducials speed up visual processing to improve throughput. With a compact footprint (1.65 m2), the system has fast-motion acceleration (2 g peak), with up to 1 m/s X-Y velocity for high throughput with ±0.025 mm repeatability. Asymtek, Carlsbad, Calif.
Product-controlled ManufacturingSiplace placement systems with dual conveyors reportedly can control production using a bar code reader. Designed to fully automate PCB manufacturing for products with the same feeder setup, product changeover is possible without requiring the line to run empty. A bar code reader mounted in the PCB input conveyor uses a laser scanner to read the bar code label on the PCB. All current bar code types are said to be supported. Siemens AG, Nuremberg, Germany.
Lead-free AlloyCASTIN was developed as a viable alternative to lead-bearing solders for all electronics assembly operations, including SMT, wave soldering, hand soldering and HASL. As a ternary alloy comprised of tin, silver, copper and a dopant of antimony, it features a near-eutectic melting temperature of 215° to 217°C. The alloy reportedly offers solid joint strength and inhibits intermetallic growth during high thermal temperature cycling. AIM Inc., Montreal, Canada.
Chip ShooterAchieving 20,000 cph, Topaz X/Xi-III is a chip shooter said to be capable of placing components from a range of 0201s to 0.015" QFPs. Because the shooter reportedly features a combination of high speed and large component range, the option of using the machine as a stand-alone or as an effective line balancer is available. Assemblèon, Alpharetta, Ga.
SPARK 400Specifically designed as an independent machine, the Spark 400 reportedly performs all assembly functions of medium and small PCB lots, automatic rework, and prototype assembly, including solder paste dispensing, pick-and-place, laser soldering and inspection. The machine uses an infrared inspection technology, using the joint's specific infrared signature to find all types of dispensing, placement, geometrical and soldering defects. BeamWorks Ltd., Beaverton, Ore.
Assembly SystemWith a 15° tilted conveyor option and greater foot space, the ClinchMaster is said to be more ergonomic and effective for semiautomatic odd-form and small-parts assembly. The upgraded tooling pin design is said to facilitate pin relocation during board changes. The new "slotted-style" tooling pin brackets are now standard on these machines. CHAD Industries, Orange, Calif.
Built-in Printing SolutionsA screen printer developed for use in PCB production and SMT applications, the KS-1700 Printer, is expected to remedy inconsistent printing and insufficient stencils by troubleshooting problems often encountered. Features are said to include an original floating and rotating squeegee head design that allows the operator to clean front and back blades. Juki Automation Systems, Morrisville, N.C.
Bluetooth Communications Test SetE1852A Bluetooth Communications Test Set is for use in the design and manufacture of Bluetooth devices in the wireless networking industry. The test set expects to address the needs of wireless designers and manufacturers who are adopting Bluetooth technology as the standard for seamless interconnectivity among electronics products. The test set reportedly has a frequency-hopping source and receiver with known performance, so results can correlate with other measurements. Agilent Technologies, Loveland, Colo.
Automated Optical Inspection SystemSV-7500 is an in-line AOI system that offers advanced color/grayscale integration, precision, high-speed scanning capability and large format, which makes it suitable for surface mount and traditional PWA inspection applications. It uses high-resolution cameras to check solder joints and verify part installation. Color-inspection capabilities are provided by the company's mega-pixel camera. Photon Dynamics, Aliso Viejo, Calif.
X-ray SystemVJ-1000-DIG high-resolution X-ray system features advanced digital detector technology consisting of a solid-state detector. The detector reportedly generates images in a digital 16-bit format, yielding more than 65,000 grayscales for analysis. Combined with a cesium iodine (CsI) or Lanex scintillator (phosphor screen), the sensor is said to present an ideal solution for high-resolution X-ray imaging applications. V.J. Technologies, Bohemia, N.Y.
Solder Paste InspectionSE 300 high-speed, high-resolution 3-D solder paste inspection system automatically measures height, volume, area and bridging as well as notifies the operator if any parameters begin trending outside user-specified limits. The user has the choice of two operating modes: high-speed, designed for fine-pitch QFPs and other traditional components; and high-resolution, for inspecting newer, smaller components. CyberOptics Corp., Minneapolis, Minn.
Inspection SystemErsascope Inspection System 3000 reportedly expands current inspection methods by providing a benchtop, nondestructive method to inspect for good solderability by visually examining hidden solder joints. The optically calibrated system reportedly can inspect height, width, radius and angle measurements as accurate as ±0.01 mm. ERSA Inc., Old Lyme, Conn.
Assembly CellThe Polaris Assembly Cell is a robotic PCB assembly system for odd-form/final assembly. The aim of this system is to combine the parts placement cost-efficiency of robotics and the user friendliness of PCB assembly equipment. Standard CAD-drive placements allow the system to be compatible with many production processes. Universal Instruments, Binghamton, N.Y.
Placement SystemsThe Intelliplacer 5 and 8 pick-and-place systems are designed for large PCB handling and flexible placement. They reportedly can accommodate PCBs up to 42.5 x 26" as well as backplanes, backpanels, panelized boards and telecom PCBs. The systems are said to be reconfigurable for high-mix applications, and a choice of head designs is said to simplify building big boards. The multimode ultra-flexible modular placement technology reportedly doubles system output. MultiTroniks, Warren, N.J.
Odd-form Cell HiSAC 1500 uses a LeadScan Sensing System to provide on-the-fly inspection of odd-form, through-hole components. The system reportedly uses a special scanning technique to inspect each component as it is moved to the placement location; and produces a scan of the component leads, allowing spacing and lead position to be measured precisely. Defective components are rejected automatically, inaccuracy in component feeding is compensated for automatically, and the system stores images of defective components to provide feedback to suppliers. PMJ Automec USA Inc., Grand Prairie, Texas.
Automated Program FeederProLINE RoadRunner, an automated programming feeder, is targeted to cellular telephone and other high-volume electronics manufacturers using Flash memory devices. The feeder includes the standard TaskLink for Windows user interface and programming process control software. This generic user interface means that current tasks and jobs already programmed on other systems can be transferred to this feeder with minor modifications. Data I/O Corp., Redmond, Wash.
MicroMax DispenserThe MicroMax Dispenser, which has a composite base that offers stability, a small footprint (36.5 x 47 x 59.5"), and a compact work area (12 x 12"), is said to be ideal for nonheated applications in SMT and semiconductor packaging. Other features include a dispense rate up to 36,000 dots per hour, closed-loop rotary encoders, a touch probe and a real-time multi-tasking operating system. GPD, a Div. of LIFT Industries Inc., Grand Junction, Colo.
Vectoral ImagingVectoral Imaging is an attempt to offer fast programming time, unprecedented accuracy in error detection and low false failure rates. By analyzing the geometric information from the features (line segments, arcs, circles, angles, etc.) and spatial relationships, this type of imaging reportedly can determine the component's position on the board without regard for component rotation, size or appearance. ViTechnology LLC, Haverhill, Mass.
Machine Performance UpgradeProFlow DirEKt Imaging reportedly averages about six times faster than screen printing with squeegees but still can use conventional stencils and solder pastes. The upgrade is a clean process, eliminating "tramlining" because it is sealed against the stencil. Paste cannot escape the sides of the transfer head so none can remain on the stencil top surface. Paste is replaced via cartridge replacement, reportedly reducing the time to approximately two minutes. DEK Printing Machines Ltd., Weymouth, Dorset, United Kingdom.
Combined AOI/AXI Inspection SystemVPS 7054, an inspection tool that reportedly detects both visible and hidden defects, combines classic visible light inspection with micro-focus X-ray inspection technology. Designed for automatic inspection and verification of single- and double-sided circuit boards, the system consists of an X-ray tube with a focal point of 5 μ, thus permitting high direct magnification with good picture definition and a possible image field size up to 8 x 11 mm. Viscom USA, Atlanta, Ga.
Stencil CleanerModel 6000 Automatic Ultrasonic Stencil Cleaner is said to reduce chemical consumption and wastewater by 40 percent, yet increase ultrasonic energy efficiency over the company's previous automatic stencil cleaners. Additionally, the cleaner requires only 3.4 gallons of 440-R SMT Detergent to establish a 10 percent wash solution, compared to 5.7 gallons for previous models. Although an ambient wash tank is provided as standard equipment, an additional heated wash tank may be incorporated for cleaning flux residue. SmartSonic Corp., Van Nuys, Calif.
Universal Support SystemProducing single- and double-sided PCBs, the Red-E-Set substrate support system for screen printers is said to reduce setup time by 84 percent. The system uses a spring-loaded pin support system designed to increase throughput, reduce defects and eliminate board flex, and each board reportedly is supported through the entire screen printer cycle. Features include spring-loaded, non-abrasive support pins that lock into place to fit a board's contour for repeat usage, and close spacing of pins that are said to provide maximum support. Production Solutions Inc., Poway, Calif.
Platform ConnectorThe GbX platform connector, an upgrade of the VHDM and VHDM-HSD platforms, boasts a 45 percent increase in signal pin density to 55 differential pairs per linear inch. Additionally, benefits are said to include a broader performance range and a unique twin-axial structure that minimizes crosstalk to support data rates up to 10 Gb/s. The connector also reportedly features a newly designed module that offers multi-stage sequencing and supports hot plug applications. Teradyne Connection Systems, a Div. of Teradyne Inc., Nashua, N.H.
Turret-based Chip ShootersThe CP-7 machine features a reported tact time of 0.068 seconds per chip (52,941 pph) and a footprint of less than 39 sq. ft. The system places components ranging from 0201 microchips to 19 mm2. Each of the machine's 16 placement heads reportedly can be fitted with six different-sized nozzles for greater control and increased speed. PCB load time is 1.2 seconds, reduced to 0.6 seconds when the machine's dual board load function is used. Fuji America Corp., Vernon Hills, Ill.
Modular Chip MounterReportedly capable of placing up to 40,000 cph, Create CM202-DH Modular Chip Mounter is said to offer unlimited expansion capabilities, flexibility and productivity for high-density component placement. Engineered for placing small components including 0201s at spacing as close as 0.15 mm in a production setting, the chip mounter uses a four-head design with a total of 24 nozzles. A double-feeder configuration includes up to 204 feeders. The modular design of the product reportedly uses 44.5 sq. ft. of production floor space. Panasonic Factory Automation Co., Franklin Park, Ill.
Pin, Socket and Terminal InsertersReportedly providing control over pressure, speed and impact, the MD Series pin, socket and terminal inserts offer vibratory bowl feed and pneumatic, pressure-sensitive operation. The inserts can accommodate parts from any supplier, and a standard throat depth of 10" is said to provide ample space for large, flat materials. Cambridge Automation, Natick, Mass.
OvenBravo 8105 Reflow Oven reportedly features eight heating zones and 105" of heated length. It is said to use a heating technology combined with a steel-fin infrastructure to offer a heat transfer surface area. Heater placement within each zone's process gas intake is said to allow individual zone-temperature control and minimal temperature deltas. Speedline ELECTROVERT, a Speedline Technologies Div., Franklin, Mass.
Camera-based Vision SensorThe In-Sight ID Reader is a self-contained, Ethernet-ready machine vision sensor reportedly designed for reading 2-D matrix and linear bar codes on parts. The ID reader is said to combine a high-performance vision camera with vision processing technology in a single, compact unit. It is expected to provide high-speed performance, reading up to 50 codes per second, and can read codes that have been poorly formed, distorted or degraded. Cognex Corp., Natick, Mass.
3-D BGA Inspection SystemThe 3-D BGA inspection system is said to find faults that X-ray inspection systems can miss. The flexible system uses advanced 3 Chip Camera technology featuring a lens design that delivers depth of field from a magnitude of 50 to 200X, and can look under a microBGA with as little as 0.002" of clearance. The lens reportedly can be rotated to yield images from various angles for solder joint, solder paste print, surface structure, placement alignment and other defect inspection. O.C. White Co., Three Rivers, Mass.
COMPONENTS
Wafer Scale CSPXtreme CSP reportedly is ideal for RF/wireless applications and can be used in numerous applications from baseband functions to RF functions. Three versions of the company's CSP technology have been introduced: Electroplated CSP features ball heights of less than 200 μm; Ball Placement CSP features ball heights greater than 200 μm; and the Single Mask CSP, said to be the most economical, is available in limited design configurations. Unitive Advanced Semiconductor Packaging, Research Triangle Park, N.C.
Chip Scale PackagingChip scale packaging now is available in a series of integrated passive networks that reportedly can be configured for a wide range of line termination and EMI/RFI filtering functions. These functions are designed to meet the demands of wireless voice and data communications in which high-density and high-frequency performance is critical. The low-profile packaging is said to give the devices an ultra-short signal path, resulting in lower parasitic inductance, which, in turn, reduces the signal delays and "ground bounce" effect that can erode high-frequency performance. International Resistive Co. Inc., Boone, N.C.
Integrated Diode NetworksEMI/RFI RC Schottky diode networks are said to perform high-speed data transmissions to reduce wave reflections and signal ringing that may cause detriment to system performance. The networks feature multiple terminating lines per package, and the resistance range for the series is 10 Ω to 10 KΩ, with a capacitance range of 10 to 100 pF. Diode capacitance reportedly is 5 pF. KOA Speer Electronics Inc., Bradford, Pa.
Miniature ResonatorThe CSTCR series (4.5 x 2.0 mm) is used in the clock circuit of a microcontroller IC and will replace the CSTCC series (7.2 x 3.0 mm). Aside from greater miniaturization, the CSTCR also offers gold terminals, making it suitable for conductive glue mounting, and operates over the frequency range of 4.00 to 7.99 MHz. The series is lead-free and has improved temperature and aging characteristics, reportedly making it suitable for demanding automotive (-40° to 125°C) applications. Murata Electronics North America, Smyrna, Ga.
Integrated Magnetics/Connector ModulesThe belMag family of shielded RJ-45 connector modules with integrated magnetics for 10/100 BASE-T Ethernet applications now includes surface mount products. Interfacing with a broad spectrum of LAN transceivers, both the new SMT version and through-hole belMag connectors reportedly are ideal for use in a wide range of applications. The connector family consists of modules in three configurations: only LAN magnetics (isolation transformers and common mode chokes); magnetics and a 2 kV capacitor; and magnetics, capacitor and termination resistors. Bel Fuse Inc., Jersey City, N.J.
Bluetooth RF ModulesThree digital, short-range RF modules for wireless communication between portable consumer devices, the new line of Bluetooth components reportedly are optimized for notebook and handheld application but may be used in any device with Bluetooth technology. The products include: a 15.1 x 13.9 x 2.2 mm 0dBm power RF module for cell phone applications; a 33.7 x 16.0 x 2.2 mm 0dBm device for PDA and handheld computing devices; and a 32.0 x 19.5 x 2.2 mm for notebook and portable PC applications. All three comply with Bluetooth specification version 1.0b, operate in the 2.4 GHz band, and support both voice and data communications. Taiyo Yuden USA Inc., San Jose, Calif.
Application-specific MOSFETSTwo families of HEXFET, new application-specific primary and secondary MOSFETS, are said to be optimized to provide the best possible efficiency for isolated DC-DC converters with outputs of 3.3 V. Using these devices in their existing designs, DC-DC converter manufacturers are expected to eliminate more than 25 percent of the losses in their 3.3 V output 200 W product lines with minimal design changes. International Rectifier, El Segundo, Calif.
Switching RegulatorsA family of switching regulators with electric volume, the S-8330 series reportedly delivers controlled output voltages from 8 to 30 V over a range of input voltages from 9 to 2 V. The output voltage can be adjusted with an 8-bit digital signal from a microprocessor or other control unit. This feature is said to make the series ideal as a bias generator for LCD graphic (dot matrix) displays. Seiko Instruments USA Inc., Torrance, Calif.
Surface Mount Diplex FilterCX6002 surface mount filter module reportedly minimizes board space, measuring 1.00 x 0.50 x 0.23". The filter reportedly separates upstream and downstream signals, delivering a low-pass signal (less than 42 MHz) at one port and a high-pass signal (greater than 54 MHz) at the second port. This is said to provide minimal crossover interference between the downstream broadcast frequency spectrum and the customer-to-Internet upstream communication band. Pulse, a Technitrol Co., San Diego, Calif.
Surface Mount InductorsSelf-leaded, surface mount DR338 Series inductors feature an open-frame, flat top design that reportedly is suitable for pick-and-place manufacturing, and has a DCR value of 0.03 to 1.5 Ω. The maximum size for the series is 0.50 x 0.40" (12.7 x 10.16 mm), with a height of 0.22" (5.5 mm). With an inductance range from 10 to 470 μH (±20 percent) and a rated current from 3.6 to 0.53 A, the series is said to operate in temperatures ranging from -40° to 85°C. Datatronics Romoland Inc., Romoland, Calif.
DIN Power ConnectorsType H11 20 A/pin DIN power connectors reportedly provide an additional 5 A/pin compared to the standard H15 solution. The male connector is provided with faston or right-angled solder terminations, and the female connector is available with straight solder pins, faston or press-fit terminations. It also is said to be possible to save space on PCBs with the new Type H11 male slimline connector, featuring the same technical specifications as the standard connector, and reportedly saving up to 985 sq. mm on the board. 2E SysCom, Waltham, Mass.
Power ConnectorsServer System Infrastructure open specifications for backplanes reportedly include backplane-distributed power systems and mid-range chassis power systems. The former is a two-power blade system, while the latter is an 11-power blade system. The last-mate-first-break recessed pins sequential mating of these connectors allows hot swapping of server power supply units. The headers have mixed-layout, blade-type contacts that are said to support up to 30 A of current. Molex Inc., Lisle, Ill.
Ultra-high K DielectricThe Maxi-Plus Series of capacitors, said to be the first K 30,000 dielectric with X7R temperature characteristics, reportedly operates in millimeter bands with low equivalent series resistance specifically for the RF/microwave, optical and cellular markets. The capacitors can be used in high-frequency broadband applications where most single-layer capacitors reputedly are less than ideal. This series is available in six standard sizes, as well as custom sizes. AVX Corp., Myrtle Beach, S.C.
Micro InterfacesMatched impedance micro interfaces, QTH/QSH Series, on 0.5 mm (0.0197") pitch are available with a choice of 60, 120, 180, 240 and 300 I/Os. The discrete ground plane between rows is surface mounted for a 100 percent surface mount system, reportedly eliminating the need for through-hole penetrations. These interconnects are said to be fully tested for 50 Ω systems for impedance, VSWR, attenuation, crosstalk and propagation delay at frequencies from 10 MHz to 1 GHz. Samtec, New Albany, Ind.
MATERIALS
Electrically Conductive EpoxyTra-Duct 925M01 is a snap-cure, low-ion, silver-filled epoxy. This two-part, smooth paste is formulated with a 1:1 mix ratio and is said to have a 24-hour pot life. It reportedly develops strong, durable, void-free electrically and thermally conducting bonds. The product can be screen printed, stenciled or applied with an automated high-speed dot dispenser. It is available in two-component Bipax packages as well as pre-mixed and frozen in syringes and cartridges for automated dispensing. Tra-Con Inc., a National Starch & Chemical Co., Bedford, Mass.
Fast Curing UnderfillThis one-component, high purity, fast cure, semiconductor grade epoxy system is designed for flip chip underfill encapsulation. With a cure time of 15 minutes at 165°C, ME-526 reportedly reduces stress between the substrate and solder bumps by keeping the solder bumps in a constant state of compression. The underfill has a low viscosity and rapidly flows under devices with stand-offs down to 0.001". The low coefficient of thermal expansion closely matches that of the solder bumps and minimizes the possibility of cracking during temperature shock and cycling testing. Thermoset, A Lord Co., Indianapolis, Ind.
Thermoplastic Bonding FilmThermo-Bond Film 644 is a thermoplastic bonding film with tack that reportedly allows quick assembly for use in a range of electronics applications. The die-cuttable film is said to adhere to many substrates, bonding materials and more. The product offers uniform area coverage and shape and thickness control, the company says. Reaching handling strength in seconds, the film is said to offer easy handling and positioning. 3M Adhesives Div., St. Paul, Minn.
Lead-free Solder ProductsA complete line of lead-free solder products, including pastes, preforms, wire, compatible fluxes and solders in a range of alloy types and melting temperatures that meet a wide variety of applications, are said to be available. Additionally, a resource center for lead-free issues, information and products can be accessed at www.Pb-Free.com. Indium Corp. of America, Utica, N.Y.
Epoxy CoatingThe Polymer System EP38 is an epoxy resin-based coating composition that reportedly exhibits boiling water resistance. It is a two-component polymer composition with a 3:1 mix ratio that cures at ambient temperatures. The formulation is 100 percent reactive and does not contain any volatiles, the company says. The coatings are said to cure tack-free, even at temperatures as low as 40°F, in short time periods. They have optical clarity that reportedly is retained under various conditions. Master Bond Inc., Hackensack, N.J.
Workstation Hand CleanerWorkstation Hand Cleaner Wipes reportedly remove toxic metals, grease, solder paste and other soils efficiently from hands right at the workstation, and are intended to reduce downtime, save money, and prevent harmful or toxic materials from being washed down the drain. These wipes, certified by an independent laboratory to leave no ionic contamination, can be used in various industrial manufacturing environments including automotive, printing, assembling and machining, among others. JNJ Industries Inc., Milford, Mass.
Dam-and-fill ProductsTwo chip-on-board encapsulation application products are high-purity epoxies designed to work together as dam-and-fill materials for bare-chip encapsulation, and reportedly protect gold wire bonds and silicon die from mechanical damage, corrosion and electrical interference. Loctite 3532 is a high-viscosity material that provides minimum flow, allowing the epoxy to act as a dam- or flow-control barrier around areas of bare-chip encapsulation. Loctite Corp., Rocky Hill, Conn.
Carbon-filled Conductive Ink121-33 is a carbon-filled, electrically conductive ink/coating designed for printing over barium Titanate inks for use as a back electrode on electroluminescent devices. As a carbon-filled material, the coating eliminates the problem of silver migration. This product, in addition to being resistant to abrasion and scratching, is said to feature strong adhesion to Kapton, Mylar, glass, barium Titanate-coated surfaces and numerous other substrates, and can be applied through various techniques. Creative Materials Inc., Tyngsboro, Mass.
Precision Cleaning AgentsSaid to be easy to use, these two cleaning agents are designed for removing all types of flux residues from electronics assemblies in ultrasonic cleaning equipment. VIGON US reportedly is a water-based cleaning agent for removing all flux residue types. Also claimed to be effective in spray-under-immersion cleaning equipment, the product is characterized by its HMIS of 0-0-0 and its long bath life (up to six months). Zestron Corp., Ashburn, Va.
Stencil CleanerThe Nu/Clean 2001 Ultrasonic Stencil Cleaner is designed to remove solder paste types including rosin (R, RMA, RA), water-soluble (OA) and no-clean pastes, as well as adhesives from stencils and screen, misprints, and related components. The system uses ultrasonics that reportedly produce powerful, nondestructive energy. Features are said to include stainless-steel wash and rinse tanks, a reportedly easy-to-operate control system and a cycle time of less than seven minutes. Technical Devices Co., a subsidiary of Winther Technologies Inc., Torrance, Calif.
Fast-flow and Snap-cure EncapsulantAMICON E 1172 is an innovative capillary flow underfill. This fast-flow, snap-cure encapsulant reportedly was formulated for use with fine-pitch area-array devices, easily underfilling services with 25 μm geometrics. Designed for applications in which SMT transparent processing is critical, the product incorporates one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance. Emerson & Cuming, A National Starch & Chemical Co., Billerica, Mass.
Black Curing CoatingThis black, solvent-free, light curing conformal coating is said to cure faster than most clear UV coatings. The black color hides the board, components and circuitry. The coating has a secondary heat curing capability. This conformal coating is designed to dispense efficiently through precision dispensing systems, which reportedly improves the coating's use and placement. Cure is affected in seconds by exposure to longwave UV and visible light. Dymax Corp., Torrington, Conn.
Reflow EncapsulantSE-CURE 9120 is a single-pass reflow encapsulant for use in attachment of flip chip/CSP devices to circuit card assemblies. 9120 reportedly functions as a fluxing agent in the first part of the process and a compression flowed underfill in the latter stages of the reflow process. The encapsulant is processed with normal surface mount materials and requires no special separate processing steps, such as underfilling or post-underfill curing operations. Litton Kester, Des Plaines, Ill.
CONTRACT SERVICES
Box Build Assembly SolutionsThe new eMPower Box Build Assembly and Production Advisor reportedly enables electronics manufacturers to better plan, design, schedule, optimize and operate box build assembly processes from assembly sequencing, layout planning, line balancing and costing through detailed 3-D workplace design, electronic work instructions, and reporting. This is accomplished by providing manufacturers with a Web-based process data management infrastructure that connects to shop floor systems. Tecnomatix-Unicam Inc., Southlake, Texas.
SMT OutsourcingThis CM reportedly has leveraged its three core competencies manufacturing, distribution and IT/electronics commerce to provide direct, real-time solutions in the SMT outsourcing industry. The company offers IT design-to-distribution services, spanning from original design capabilities to custom systems configuration, enterprise-level customization, fully integrated supply chain management, build-to-order (BTO) and configure-to-order (CTO), PCB assembly, final production, materials management, and logistics services. SYNNEX Information Technologies Inc., Fremont, Calif.
Electronics Manufacturing ServicesHolding 37 patents and more than 30 pending patents involving manufacturing processes, technologies, tooling and equipment, MCMS has the most patents in the CEM services industry. Under the guidance of the executive MCMS Technology Steering Committee and Global Technology Council, the company reportedly deploys and leverages its technical innovation by maintaining common manufacturing equipment, processes and systems across its sites globally. MCMS Inc., Nampa, Idaho.
Machine Vision and Control Strategy ToolsTwo services are available in offering assistance in designing and implementing machine vision and control strategies, and volume industrial PC Systems supply. Previously available only as part of the company's core products, these tools are associated with such machine vision tasks as image acquisition, identification, recognition and realignment. The industrial PC systems supply service reportedly are offered for each machine with pre-loaded operating systems and application software. ORS Automation Inc., Princeton, N.J.
Contract EMSIn addition to delivering design, assembly, purchasing, test and after-sales service of electronics products, this European services provider is said to offer a permanent source of improvement, including technical solutions, process enhancement and productivity gains. The company has a multinational customer base that is active in the fields of telecom, automotive, multimedia, household appliances and industrial products. This base is served by their four manufacturing sites in Eastern and Western Europe. Sofrel, Montlimart, France.
SOFTWARE
Physical Design Verification SoftwareThe 6.0 version of Enterprise 3000 DFM software for PCB physical design verification was developed to solve the complex challenge of efficient manufacturability rules management across global supply chains. Aimed at improving collaboration between OEMs and CMs in generating optimized PCB manufacturing data for right-first-time production, the software reportedly can produce PCB designs that can move through manufacturing with fewer reworks and errors. Valor Computerized Systems, Yavne, Israel.
Image Processing SoftwareAn X-ray image processing software, GTI-5000 reportedly empowers a PC workstation running Windows 2000 or Windows NT to perform complex inspection routines required for leading-edge packaging technologies. The software is fully networkable and capable of allowing users to share image and data files. The software package, which performs real-time image processing of X-ray images, reportedly requires a PC with a 10/100 PCI network card, imaging hardware to support RS-170 video, a 32 MB AGP graphics card, an Intel PIII CPU with a minimum of 667 MHz and at least 128 MB/133 MHz of SDRAM memory, and a CD and floppy drive. Glenbrook Technologies Inc., Randolph, N.J.
Assembly SoftwareThe CircuitCAM Factory Modeler module software creates a virtual factory to bring organization and real-world process intelligence to a CIM environment. The Factory Modeler provides a graphical, drag-and-drop environment for building routings to all process machinery. The software reportedly uses "dynamic process assignment," which automatically filters process data to individual machines in the assembly line. Aegis Industrial Software Corp., Horsham, Pa.
Self Profiling Oven SoftwareKIC Pilot is a software program installed on the oven controller PC and allows a low-skilled operator with one hour's training to set up a profile. Key features of this software reportedly include direct automated communication with the oven controller software; an automated profile prediction tool that can analyze billions of potential oven setups to find the optimal profile in less than a minute; the Process Window Index: a statistical method for ranking thermal profile performance; and a simplified operator interface that allows rapid training. KIC Thermal Profiling, San Diego, Calif.
Multi-user SoftwareTPSys 2.2 software, developed in Linux, is a real-time operation system with multi-user and multitasking functions. Recent upgrades include a generic BGA editor, extended information in error messages, graphical component in locate feeder, improved centering, alarm on reels and more. Additionally, an improved stepper has been integrated into the new version, allowing the ability to single step the machine's moving sequences. MYDATA automation, Peabody, Mass.
SoftwareGR TestPak Switching is a software application designed to improve functional test program development. Its module reportedly uses a point-and-click routing of virtually any stimulus or measurement and is available for the company's PCI-based functional test systems, the GR Versa and the GPX621 Test Mainframe. Users of the PXI-based test systems can use this new software to eliminate the process of manually programming functional test program switching sequences. GenRad Inc., Westford, Mass.
Selection and Design SoftwareCOMBICON SELECT, an online selection and design software for PCB terminal blocks, reportedly allows engineers instant access to the industry's broadest line of PCB wiring solutions. Users input application requirements, select a product solution, and review technical specifications and drawings. Product drawings and board layout data can be downloaded in 2- or 3-D and can be imported into the design. Phoenix Contact Inc., Harrisburg, Pa.
PCB Inspection SoftwareORION PCB Inspection Software features data manager, data monitoring and data analysis capabilities. The data manager tool reportedly provides faster storage and retrieval of archived inspection data, allowing product traceability while reducing the amount of valuable data storage space required. The data monitoring tool is said to allow control engineers to have an early warning system to quickly address process problems on-line before an emergency occurs. Omron Electronics Inc., Schaumburg, Ill.
Process Control SoftwareQPC, a real-time quality process control software tool, is for use in conjunction with the company's Trion-2000 AOI series. The software processes statistical data and visualizes inspection data results for line performance monitoring and reporting at selected process stages. With this tool, manufacturers reportedly can identify undesirable trends and problems and take corrective action to avoid negative impact on yield. Orbotech Ltd., Yavne, Israel.