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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Trouble in Your Tank: Those Problematic Soldermask Issues
I am sure you have heard the words, “It’s not rocket science.” Apologies to the rocket scientists. Sometimes PCB fabrication just makes it look that way. This month’s Trouble in Your Tank approaches the subject of soldermask adhesion using an actual case study. As the reader will note, I recommend using sound troubleshooting methodology to zero in on the root cause of the problem.
Problem Statement
A medium-sized U.S.-based PCB fabricator had started to experience adhesion failures of liquid photoimageable soldermask on select part numbers. The company utilizes a double-sided screen printing machine to apply the solder mask.
The fabricator claims that “nothing has changed” (I love that one). Read the full column here.
Editor's Note: This column originally appeared in the January 2013 issue of The PCB Magazine.
More Columns from Trouble in Your Tank
Trouble in Your Tank: Interconnect Defect—The Three Degrees of SeparationTrouble in Your Tank: Things You Can Do for Better Wet Process Control
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 5
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
Trouble in Your Tank: Electrodeposition of Copper, Part 6
Trouble in Your Tank: Electrolytic Copper Plating, Part 5
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4