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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Trouble in Your Tank: Those Problematic Soldermask Issues
I am sure you have heard the words, “It’s not rocket science.” Apologies to the rocket scientists. Sometimes PCB fabrication just makes it look that way. This month’s Trouble in Your Tank approaches the subject of soldermask adhesion using an actual case study. As the reader will note, I recommend using sound troubleshooting methodology to zero in on the root cause of the problem.
Problem Statement
A medium-sized U.S.-based PCB fabricator had started to experience adhesion failures of liquid photoimageable soldermask on select part numbers. The company utilizes a double-sided screen printing machine to apply the solder mask.
The fabricator claims that “nothing has changed” (I love that one). Read the full column here.
Editor's Note: This column originally appeared in the January 2013 issue of The PCB Magazine.
More Columns from Trouble in Your Tank
Trouble in Your Tank: Understanding Interconnect Defects, Part 2Trouble in Your Tank: Understanding Interconnect Defects, Part 1
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
Trouble in Your Tank: Can You Drill the Perfect Hole?
Trouble in Your Tank: Yield Improvement and Reliability
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper