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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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Trouble in Your Tank: The Root Cause of ICDs, Part II
One can never get enough of a bad thing. And that applies to circuit board fabrication and technical issues such as ICDs. In the September 2012 Trouble in Your Tank column in this magazine, I summarized the different types of ICD and even covered an actual case history. In Part II, I present another case study and again challenge the reader to test his or her troubleshooting skills.
This article originally appeared in the March 2013 issue of The PCB Magazine.
More Columns from Trouble in Your Tank
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless CopperTrouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Trouble in Your Tank: Interconnect Defect—The Three Degrees of Separation
Trouble in Your Tank: Things You Can Do for Better Wet Process Control
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 5
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
Trouble in Your Tank: Electrodeposition of Copper, Part 6