The New Chapter: The Benefits of Continuing Education
It’s Only Common Sense: You’ve Got to Hustle
Estimated reading time: Less than a minute
Trouble in Your Tank: Optimizing the Soldermask Process, Part 3
In previous columns (May and June, 2013) related to the soldermask process, I presented critical information on ink properties, methods of soldermask application, tack drying, etc. In this column, the exposure process is detailed. This includes exposure units, UV lamps, the phototool, and the overall exposure energy.
Exposure Process
Once the soldermask ink is applied and properly tack dried, it is now necessary to expose the soldermask. Optimum exposure is critical in attaining a quality image. Essentially, exposure works hand-in-hand with development to maintain fine features and tight soldermask dams. Make no mistake: Proper exposure is the first step in the proper definition of the soldermask image. In order to achieve optimum exposure results the operator must consider the following:
- Exposure units;
- UV lamps;
- The photo tool or photographic template; and
- Exposure energy.
All of these factors or critical aspects are important in order to optimize the exposure process. Each will now be presented in some detail.Read the full column here.Editor's Note: This column originally appeared in the October 2013 issue of The PCB Magazine.
Share on:
More Columns from Trouble in Your Tank
Trouble in Your Tank: Interconnect Defect—The Three Degrees of SeparationTrouble in Your Tank: Things You Can Do for Better Wet Process Control
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 5
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
Trouble in Your Tank: Electrodeposition of Copper, Part 6
Trouble in Your Tank: Electrolytic Copper Plating, Part 5
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4