-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Cadence’s Brad Griffin Digs Deep Into DDR
February 22, 2015 | Kelly Dack, I-Connect007Estimated reading time: 12 minutes

Guest Editor Kelly Dack stopped by the Cadence Design Systems booth at DesignCon 2015, where he sat down with Product Marketing Manager Brad Griffin to discuss Cadence’s advanced PCB design and signal integrity tools, and the company’s focus on DDR.
Kelly Dack: Brad, since you’re the product marketing director for Cadence Design Systems, I’d like to ask a few questions about your DDR products. But first, please give us a brief overview of DDR.
Brad Griffin: I’d be happy to. One of the main things with a computer is that it has memory and you can store data in that memory—that’s kind of what makes it a computing device. So they’ve been finding ways over the life of electronics to store and retrieve data faster out of memory. Somewhere around 2002, we came up with this idea of doubling the data rate in DDR memory, or double data rate memory. That was unique because basically, we clocked the data into the memory, both on the rising edge and on the falling edge of the clock. It was a clever way with the same sort of signaling to basically double the data rate speeds.
KD: Was there an organization involved? Was it standardized?
BG: That’s really good question. As of right now, there's a standard committee called JEDEC, and I'm going to assume they were in place back in the 2002 timeframe, but I’d have to go back and check. But obviously there's memory companies and they have to be able to plug-and-play with different controllers as they’re driving the memory, so there's probably always been a standard they’ve been marching toward. That process used to be a lot simpler. You’d be transferring data at maybe 100 megabits per second. You would send the data, clock it in, and it wasn’t nearly as complicated as it is now.
KD: So where has DDR come from, and where is it now?
BG: There was DDR2 and then DDR3, and probably 2015 is going to be the transition where most DDR3 designs go over to DDR4. Typically, this happens because the DDR4 memory will actually become less expensive than some of the DDR3 memory.
KD: What does that mean as far as the technology from a power standpoint as well as a data standpoint?
BG: The main difference from a technology standpoint from DDR3 to DDR4 is the speed. It basically just gets faster. So any application you have in the computer that’s run with DDR4 memory will make for a faster computer than one running with DDR3. One of the exciting things that has migrated probably over the last five to seven years is this new version of DDR called LPDDR, which stands for low power. That’s been something primarily used in mobile devices because you certainly don’t want your cell phone to run out of power in the middle of the day.
KD: With this reference to power, if I understand correctly, DDR came from a 2.5 V system and shrunk to 1.8 V and 1.5 V, and DDR4 is down at a little over 1 V. That seems really low already, so where will the LPDDR take us?
BG: If you can believe it, the LPDDR4 specification only has a 300 mV swing, so it's really low. That means that for signal integrity and power integrity engineers, there's really very little margin left. We said there was very little margin left when it was 1.5 V, and now we’re down to 300 mV; this very small swing of data means that your signals have to be clean and your power planes have to basically be stable. Because then you have to have a power/ground bounce associated with simultaneous switching signals. It’s going to basically make it so that you're not going to meet the signal quality requirements that JEDEC puts in place for LPDDR4. So designs are getting really interesting. What we’re excited about this year at DesignCon are the things we’ve been putting into our tools to enable designers to validate that they've done everything they need to do to meet the LPDDR4 requirements.
Page 1 of 3
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.