Enthone Advanced Technology Center to Open in 2016
June 2, 2015 | Enthone Inc.Estimated reading time: 2 minutes

Enthone Inc. today announced that construction is underway to expand and transform the company’s West Haven, CT Global Headquarters to become a premier technology and manufacturing center. The renewed location will be completed by 2016 and will be named, the Enthone Advanced Technology Center.
The Enthone Advanced Technology Center represents a total investment that will exceed USD 12.5 million and will initially encompass over 82,000 sq. ft. of research and development, technical applications engineering, quality assurance and testing laboratories, as well as state-of-the-art manufacturing facilities.
Mr. Rick Reagan, President Enthone said, “The Enthone Advanced Technology Center is part of the Alent Investment for Growth Initiative, whereas our parent is committed to investing for the future by ensuring that all technology facilities are resourced with leading edge capabilities and world class teams that will continually provide next-generation products.”
The continued development of the West Haven, CT campus includes the 2014 opening of the ViaForm® Copper Damascene Manufacturing Facility, as well as recent and on-gong upgrades made to wafer level packaging manufacturing, printed circuit board applications laboratories, and the ISO/IEC 17025:2005 certified Enthone Automotive Corrosion Applications Laboratory. The Enthone Advanced Technology Center will continue to maintain ISO certifications to the Environmental Management System ISO 14001, Occupational Health & Safety System OHSAS 18001 and ISO 9001 registration for a true Integrated Management System.
Mr. Jason Maupin, Vice President – Enthone Americas said, “The Connecticut location is being transformed to address growing market demands, while further enabling the ability to meet a more stringent set of electronics and automotive industry requirements. The synergies of housing Enthone technical applications, ‘fast cycle’ R&D, engineering, and manufacturing at one central location will further optimize customer value creation throughout the Americas and the world.”
As part of the expansion, Enthone executive and support staffs will be relocating to Trumbull, Connecticut. The relocation will allow for future manufacturing, testing, R&D, and applications engineering expansion.
About Enthone
The Enthone Advanced Technology Center will be further supported by the company’s Wafer Level Packaging Applications Laboratory in Mission Hills, California, as well as Global Development Applications Centers strategically located in Germany, Taiwan, Singapore, Shanghai (PRC), and India.
Enthone Inc., an Alent plc company, is a global and leading supplier of high performance specialty chemicals and coatings. Enthone creates customer value by providing innovative and cost-effective technology solutions to the automotive, electronics, building hardware, energy, aerospace, jewelry, industrial finishes, printed circuit board and semiconductor industries. For more information, please visit enthone.com.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.