Enthone Advanced Technology Center to Open in 2016
June 2, 2015 | Enthone Inc.Estimated reading time: 2 minutes

Enthone Inc. today announced that construction is underway to expand and transform the company’s West Haven, CT Global Headquarters to become a premier technology and manufacturing center. The renewed location will be completed by 2016 and will be named, the Enthone Advanced Technology Center.
The Enthone Advanced Technology Center represents a total investment that will exceed USD 12.5 million and will initially encompass over 82,000 sq. ft. of research and development, technical applications engineering, quality assurance and testing laboratories, as well as state-of-the-art manufacturing facilities.
Mr. Rick Reagan, President Enthone said, “The Enthone Advanced Technology Center is part of the Alent Investment for Growth Initiative, whereas our parent is committed to investing for the future by ensuring that all technology facilities are resourced with leading edge capabilities and world class teams that will continually provide next-generation products.”
The continued development of the West Haven, CT campus includes the 2014 opening of the ViaForm® Copper Damascene Manufacturing Facility, as well as recent and on-gong upgrades made to wafer level packaging manufacturing, printed circuit board applications laboratories, and the ISO/IEC 17025:2005 certified Enthone Automotive Corrosion Applications Laboratory. The Enthone Advanced Technology Center will continue to maintain ISO certifications to the Environmental Management System ISO 14001, Occupational Health & Safety System OHSAS 18001 and ISO 9001 registration for a true Integrated Management System.
Mr. Jason Maupin, Vice President – Enthone Americas said, “The Connecticut location is being transformed to address growing market demands, while further enabling the ability to meet a more stringent set of electronics and automotive industry requirements. The synergies of housing Enthone technical applications, ‘fast cycle’ R&D, engineering, and manufacturing at one central location will further optimize customer value creation throughout the Americas and the world.”
As part of the expansion, Enthone executive and support staffs will be relocating to Trumbull, Connecticut. The relocation will allow for future manufacturing, testing, R&D, and applications engineering expansion.
About Enthone
The Enthone Advanced Technology Center will be further supported by the company’s Wafer Level Packaging Applications Laboratory in Mission Hills, California, as well as Global Development Applications Centers strategically located in Germany, Taiwan, Singapore, Shanghai (PRC), and India.
Enthone Inc., an Alent plc company, is a global and leading supplier of high performance specialty chemicals and coatings. Enthone creates customer value by providing innovative and cost-effective technology solutions to the automotive, electronics, building hardware, energy, aerospace, jewelry, industrial finishes, printed circuit board and semiconductor industries. For more information, please visit enthone.com.
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.