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Suggested Items

Preventing Surface Prep Defects and Ensuring Reliability

06/10/2025 | Marcy LaRont, PCB007 Magazine
In printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.

IDC Increases its PC and Tablet Forecasts Despite Tariff Uncertainty

06/02/2025 | IDC
After recording strong results in the first quarter of 2025, IDC is increasing its traditional PC forecast for 2025 — this comes despite the significant impact that US tariffs have had on its trading partners’ market sentiment.

Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC

05/22/2025 | Indium Corporation
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.

Electronics Industry Demand Holds Steady Amid Tariff Turbulence

05/22/2025 | IPC
Electronics manufacturers are bracing for higher costs as profit pressures deepen according to IPC’s May Sentiment of the Global Electronics Manufacturing Supply Chain Report.

NUS Physicists Discover a Copper-free High-temperature Superconducting Oxide

03/28/2025 | PRNewswire
Professor Ariando and Dr Stephen Lin Er Chow from the National University of Singapore (NUS) Department of Physics have designed and synthesised a groundbreaking new material—a copper-free superconducting oxide—capable of superconducting at approximately 40 Kelvin (K), or about minus 233 degrees Celsius (deg C), under ambient pressure.
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