Ducommun Completes New Credit Agreement
June 29, 2015 | Business WireEstimated reading time: 1 minute
Ducommun Inc. has entered into a new $475 million credit agreement – consisting of a $200 million revolving credit facility and a $275 million term loan facility – to replace its existing debt structure. In connection with the transaction, the Company has repaid an existing $80 million term loan and called $200 million of outstanding 9.75% senior unsecured notes due 2018.
The New Credit Agreement includes a significantly lower variable interest rate on borrowings than the debt it replaces and has a final maturity date of June, 2020. The variable interest rate on the New Credit Agreement will initially be LIBOR plus 2.50%, subject to adjustments based on the Company’s leverage ratio. The Company estimates that the effective interest rate upon closing is approximately 3.50%.
“We’re very pleased to announce this new credit agreement, which will decrease our interest expense and improve our net income significantly,” said Anthony J. Reardon, chairman and chief executive officer. “We have been dedicated to reducing our debt, lowering the Company’s leverage, and strengthening Ducommun’s balance sheet for years. This refinancing positions the Company for greater financial flexibility as well as higher returns for our shareholders going forward.”
Detailed information regarding the New Credit Agreement is included in the Company's Current Report on Form 8-K filed with the Securities and Exchange Commission. Bank of America, N.A. acted as Administrative Agent, Swingline Lender and L/C Issuer; Wells Fargo Bank, N.A. acted as Syndication Agent; and General Electric Capital Corporation, BBVA Compass Bank and MUFG Union Bank, N.A. acted as Documentation Agents for the New Credit Agreement. Bank of America Merrill Lynch, Wells Fargo Securities, LLC and GE Capital Markets also served as joint lead arrangers and joint book runners.
About Ducommun Incorporated
Founded in 1849, Ducommun Incorporated provides engineering and manufacturing services to the aerospace, defense, and other industries through a wide spectrum of electronic and structural applications. The company is an established supplier of critical components and assemblies for commercial aircraft and military and space vehicles as well as for the energy market, medical field, and industrial automation. It operates through two primary business units – Ducommun AeroStructures (DAS) and Ducommun LaBarge Technologies (DLT). Additional information can be found at www.ducommun.com.
Suggested Items
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.
Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
06/18/2025 | PRNewswireParis Air Show -- Indra and the Indian technology company AXISCADES have signed an agreement to collaborate on the production of solutions for the aerospace and defense markets.