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iNEMI End-of-Project Webinar to Highlight Repair and Recyling Metrics
July 10, 2015 | Stephen Las Marias, I-Connect007Estimated reading time: 1 minute
iNEMI will be holding an "End-of-Project" webinar on July 29 , the focus of which will be on Repair and Recyling Metrics.
Open to members and non-members, the webinar will feature the project team, including Wayne Rifer (Green Electronics Council) and Lisa Dender (IBM), presenting the findings of their review of existing standards and methodologies for the quantification of recycling and repair at the product level. The discussion will focus on what exists today, and what is needed in the future to best provide consistent metrics for both recycling and repair of electronic products.
The webinar aims to:
- Build an evaluative framework from a set of criteria and traits that need to be measured to determine true recyclability and reparability (at a minimum), and may also include, reusability and remanufacturability (4Rs) for consumer and enterprise ICT products.
- Conduct an assessment of whether existing practices/tools/specifications (especially IEC TR 62635) are adequate to meet the needs of industry and other stakeholders in regards to providing methodology for the quantification of the "4Rs" of electronic products, including whether the current methodologies allow adequate quantification of the economics of each of these traits.
- Identify gaps and make recommendations for the need to develop robust methodology and tools to quantify each of the 4Rs of electronic products in enough detail to allow purchasers to compare products of the same category. The objective is to provide a single methodology that becomes adopted industry-wide for the quantification of the 4Rs.
For more information or to register, click here.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!