Techcon Systems to Exhibit at AUTOMATION 2015 India
July 14, 2015 | Techcon SystemsEstimated reading time: 2 minutes

Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, will exhibit in Booth I-41, Hall 1 at AUTOMATION 2015, scheduled to take place August 24-27, 2015 at the Bombay Convention and Exhibition Center in Mumbai, India. Company representatives will showcase the new TSR2000 Bench Top Robot and the full Techcon range of fluid dispensing solutions.
The TSR2000 Bench Top Robot Series delivers consistent, high-performance dispensing results at an affordable price. This versatile dispensing platform is ideal for a wide range of fluid dispensing applications, from inline to batch and for the following applications: dispense dots of solder paste, form-in-place gasket, filling, potting, encapsulation, bonding, coating and many more. Three models are available (TSR2201, TSR2301 and TSR2401) to accommodate a wide range of working envelopes. The easy-to-program robot features dedicated fluid dispensing software, eliminating the need for complex robot language programming. With fully integrated positioning and fluid dispensing functions, the system is compatible with all Techcon Systems syringes, valves and jet dispensing systems.
Techcon Systems will display the TS6500 Series cartridge mixer providing complete automatic mixing of two-component material filled in a cartridge kit. The features rich TS6500 Series accommodates all standard size cartridge kits ranging from 2.5 oz. (74 ml) to 20 oz. (591 ml) and is immediately usable anywhere in the world with its accompanying tools, accessories and universal power supply. Equipped with an automatic fluid level sensing device and user-friendly electronic control system, the TS6500 Series mixer allows for a quick, simple setup process. The automatic injection feature provides even distribution of the hardener into the resin during the mixing cycle to ensure a uniform mixed result.
Techcon Systems also will showcase its wide array of fluid dispensing components, ranging from disposable accessories to complete digital controlled dispensing systems and precision valves for automation. For more information, please contact the Techcon Systems team by visiting www.techconsystems.com.
About Techcon Systems
Techcon Systems was established in 1961 to service industrial manufacturing markets and has continued to be a leader in fluid dispensing systems and products. In 1996, OK International acquired Techcon Systems, providing a strong global sales channel, with direct subsidiaries in the UK. Today, Techcon represents OK International’s Industrial Product Division. Currently focusing on fluid dispensing systems, Techcon’s components are used in medical, automotive, telecommunications, aerospace, and industrial applications worldwide, helping to improve manufacturing processes and increase the customers’ bottom lines. Techcon offers an array of fluid dispensing products and provides dispensing components ranging from disposable accessories to complete microprocessor-controlled dispensing systems, and precision valves. For more information, visit the company at www.techconsystems.com.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.