NRL Takes LEAP in NextGen Materials Design
July 28, 2015 | U.S. Naval Research LaboratoryEstimated reading time: 2 minutes

The U.S. Naval Research Laboratory (NRL), Materials Science and Technology Division, has taken delivery of a state-of-the-art Cameca 4000X Si Local Electrode Atom Probe (LEAP), a high performance microscope that provides precise atom-by-atom dissection of a material volume, enabling true three-dimensional (3D) atomic-scale reconstructions of material microstructures.
Local Electrode Atom Probe (LEAP) microscopeThe U.S. Naval Research Laboratory, Washington, D.C., has taken delivery of the only Local Electrode Atom Probe (LEAP) microscope in use in the U.S. Department of Defense (DoD). Researchers at the laboratory's Materials Science and Technology Division will utilize the atom probe to analyze materials at the atomic level for optimizing new, next-generation alloys and semiconducting materials.
"Exact knowledge of where individual atoms are in a material is of tremendous benefit when engineering new materials," said Keith Knipling, NRL Materials Science and Technology Division. "We expect the LEAP to greatly enhance our capability to develop new materials, including the next generation of structural alloys for stronger ship hulls and more advanced turbine engines, new electronic materials for tomorrow's faster integrated circuits, and advanced solar cell and battery materials with improved power and energy efficiency."
The LEAP works using the principle of field evaporation, whereby a strong electric field applied to a needle-like specimen is sufficient to cause removal of atoms by ionization. Atom evaporation is triggered either by a voltage or laser pulse applied to the sample. The resulting ions are accelerated away from the specimen and identified chemically by time-of-flight mass spectrometry and their positions are deduced from the coordinates of ion impacts on a position-sensitive detector. By repeating this sequence, the atoms are progressively removed from the tip, and a 3D image of the material can be reconstructed at the atomic scale.
"Mapping the location of each chemical species in a material microstructure enables an unprecedented understanding of the true effects of alloying and material synthesis, which is essential for truly optimizing the properties of any material. We expect the LEAP to deliver new atomic-scale perspective and insights into a wide range of materials science investigations. For example, researchers at NRL are developing semiconductor materials with very dilute levels of added 'dopant' atoms for the purpose of tailoring their electrical properties," Knipling adds. "These doped materials form the building blocks of nearly all semiconductor electronic devices such as diodes, transistors, solar cells, LEDs, and integrated circuits. Most analytical techniques are incapable of measuring these small concentration levels, much less where the dopants segregate within the microstructure. With the LEAP, researchers can now answer these questions."
Worldwide, there are only a handful of LEAP microscopes in use. NRL Materials Science and Technology Division possesses the only one in use by the U.S. Department of Defense (DoD).
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.