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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

SEMICON West 2026 to Spotlight $1 Trillion Semiconductor Milestone and Next-Gen Technologies

08/28/2026 | SEMI
SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, announced keynotes and program highlights for this year’s SEMICON® West on October 13–15 at the Moscone Center in San Francisco. Registration is open.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/14/2026 | Marcy LaRont, I-Connect007
Another week has flown by, and it’s time for the must-read articles and news highlights. This week, I’m putting a spotlight on FUJI PCB and FS Quality, through an interview by Dan Beaulieu with President Tianming Liu, and “the rest of the story” from the EIPC Summer Conference technical sessions. I’m also focusing on a new marketing book by Brittany Martin, and there’s rarely a week when we don’t talk about AI, so I also chose Sean Patterson’s most recent practical advice for PCB fabricators. Though the U.S. has placed a “stay” on CMMC Level 2 certification, it’s still coming for you and your business. If you work in the Mil/Aero space in the U.S., check out what Omega EMS has done to accelerate its compliance. Their wisdom may be worth your time.

Summit Interconnect Celebrates 10 Years

07/28/2026 | Marcy LaRont, I-Connect007 Magazine
Ten years ago, Shane Whiteside had a vision for the dwindling North American PCB industry: to develop a company at scale that would put North American PCB manufacturing back on the map. The result was the combination of six PCB organizations and complementary businesses to create Summit Interconnect, now the second-largest PCB manufacturer in North America. In this interview, Summit CEO Shane Whiteside and Vice President of Technology Gerry Partida reflect on Summit's 10th anniversary, the pride they take in what they've built, and the enthusiasm they still bring to the business as they celebrate this milestone.

Kaney Announces $2.88 Million Investment to Expand BGT Aerospace Operations in Freeland

07/20/2026 | Kaney, Inc.
Kaney, Inc., a Velocity One portfolio company, today announced a $2.88 million investment in its BGT Aerospace facility in Freeland, Michigan, expanding manufacturing capacity, adding advanced production equipment, and reinforcing the company's long-term commitment to the local community

3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.
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